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NVMFD5853NWFT1G

Onsemi

NVMFD5853NWFT1G by Onsemi

NVMFD5853NWFT1G by Onsemi is an N-CHANNEL Power FET with 53A max drain current and 58W max power dissipation. It operates in enhancement mode, suitable for applications requiring high power handling such as motor control and power supplies.

Median Price

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Lifecycle Status

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2

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1k+

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Digiode

USA . 2,357 parts In-Stock

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Vyrian

USA . 1,989 parts In-Stock

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AZTECH Wire

Italy . 913 parts In-Stock

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Problanco Electronics

Mexico . 5,029 parts In-Stock

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Perfect Parts

USA . 4,760 parts In-Stock

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Kulean Microsystems

USA . 4,007 parts In-Stock

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SupplyDigital Components

Austria . 3,284 parts In-Stock

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TANS Electronics

Latvia . 2,562 parts In-Stock

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UHIMA Technologies

Türkiye . 941 parts In-Stock

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Corohmni

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Corphita

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Overview

Upgrade your power systems with the NVMFD5853NWFT1G by Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor. With a maximum drain current of 53A and a power dissipation of 58W, this enhancement mode FET is designed for efficiency and reliability. Ideal for a wide range of applications, from automotive to industrial, this transistor offers superior performance and durability. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the NVMFD5853NWFT1G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are ideal for high-power applications and offer lower on-state resistance, making them efficient for power management.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB designs, saving space and reducing assembly time.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the FET, allowing for precise switching and power management.

Maximum Drain Current (Abs): 53 A

The high maximum drain current rating ensures that the FET can handle high power loads without overheating or failure.

Maximum Power Dissipation (Abs): 58 W

With a high maximum power dissipation rating, this FET can effectively dissipate heat and operate at high power levels without damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability, low leakage current, and improved switching characteristics for better performance.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate in demanding environments without sacrificing performance or reliability.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, ensuring reliable connections and minimizing electrical resistance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature helps prevent damage to the FET during soldering and assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable and efficient soldering of the FET onto the PCB, ensuring long-term performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5853NWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

53 A

Maximum Drain Current (ID):

53 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFD5853NWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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