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NVMFD5852NLWFT1G

Onsemi

NVMFD5852NLWFT1G by Onsemi

NVMFD5852NLWFT1G by Onsemi is an N-CHANNEL Power FET with 40V DS Breakdown Voltage, 329A IDM, and 0.012 ohm RDS(on). It is used in applications requiring high power dissipation and operates in enhancement mode.

Median Price

$1.151

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

$0.938

10k+ parts

$0.836

7,500

-

$1.130

$0.938

$0.836

Verical

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.172

10k+ parts

$1.045

7,500

-

-

$1.172

$1.045

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,928 parts In-Stock

1+ parts

$0.877

100+ parts

-

1k+ parts

-

10k+ parts

-

1,928

$0.877

-

-

-

Chip Stock

USA . 36,000 parts In-Stock

1+ parts

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36,000

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Vyrian

USA . 8,690 parts In-Stock

1+ parts

-

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8,690

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,628 parts In-Stock

1+ parts

$0.831

100+ parts

-

1k+ parts

-

10k+ parts

-

1,628

$0.831

-

-

-

Corohmni

South Africa . 370 parts In-Stock

1+ parts

$0.923

100+ parts

-

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-

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-

370

$0.923

-

-

-

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$18.730

100+ parts

-

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-

709

$18.730

-

-

-

Component Stockers USA

USA . 564 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

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564

$99.990

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 24,583 parts In-Stock

1+ parts

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24,583

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SupplyDigital Components

Austria . 7,249 parts In-Stock

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7,249

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TANS Electronics

Latvia . 6,994 parts In-Stock

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6,994

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Kulean Microsystems

USA . 6,117 parts In-Stock

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6,117

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Problanco Electronics

Mexico . 378 parts In-Stock

1+ parts

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378

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UHIMA Technologies

Türkiye . 281 parts In-Stock

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281

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Overview

Unleash the power of innovation with the NVMFD5852NLWFT1G by Onsemi. As a leader in the manufacturing industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are perfect for a wide range of applications. This N-CHANNEL transistor boasts separate elements with a built-in diode, ensuring seamless operation. With a high breakdown voltage and maximum drain current, this transistor offers unparalleled performance and reliability. Upgrade your projects with the Onsemi NVMFD5852NLWFT1G and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection for the internal components, making the FET suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and faster switching speeds compared to P-channel FETs, making this product suitable for high-performance applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with built-in diode allows for more flexibility in circuit design and can help with reverse current protection, making this FET versatile and efficient.

Maximum Drain-Source On Resistance: 0.012 ohm

The low on-resistance of 0.012 ohm ensures minimal power loss and high efficiency in the circuit, making this FET suitable for high current applications.

Maximum Power Dissipation (Abs): 27 W

With a high power dissipation rating of 27 W, this FET can handle heavy loads and high current levels without overheating, ensuring reliability in demanding applications.

Maximum Operating Temperature: 175 °C

The high operating temperature range of 175 °C allows the FET to withstand harsh environmental conditions and maintain stable performance in challenging applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5852NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

329 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFD5852NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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