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NVD6824NLT4G

Onsemi

NVD6824NLT4G by Onsemi

NVD6824NLT4G by Onsemi is a Power FET with 100V DS Breakdown Voltage, 231A IDM, and 0.023 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for power management applications requiring high current handling capabilities.

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Lifecycle Status

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8

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1k+

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Avnet

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Chip Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 4,246 parts In-Stock

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Flip Electronics

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Bristol Electronics

USA . 2,178 parts In-Stock

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Digiode

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Prism Electronics

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AZTECH Wire

Italy . 299 parts In-Stock

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Perfect Parts

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RC Electronics

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Futuretech Components

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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SupplyDigital Components

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Corphita

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A-Z Elektronik GmbH

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UHIMA Technologies

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Overview

Elevate your power management game with the NVD6824NLT4G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET boasts a single configuration with a built-in diode, offering enhanced performance and reliability. Ideal for a range of applications, this small outline package is designed to deliver maximum power dissipation and efficiency. Say goodbye to power fluctuations and hello to seamless operations with the NVD6824NLT4G. Experience the Onsemi advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material helps provide durability and protection for the internal components of the field effect transistor, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide reverse polarity protection, improving the overall efficiency and reliability of the system.

Maximum Drain-Source On Resistance: 0.023 ohm

The low on-resistance of 0.023 ohms helps minimize power losses and improve efficiency in power applications, making this FET a good choice for high-current circuits.

Maximum Power Dissipation (Abs): 88 W

With a high power dissipation rating of 88 W, this FET can handle large amounts of power without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows the FET to operate reliably in elevated temperature environments, increasing its versatility in various applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD6824NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

41 A

Maximum Drain Current (ID):

8.5 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

231 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD6824NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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