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NVD6828NLT4G

Onsemi

NVD6828NLT4G by Onsemi

NVD6828NLT4G by Onsemi is a Power FET with 90V DS Breakdown Voltage, 206A IDM, and 0.031 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 73,000 parts In-Stock

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Vyrian

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Digiode

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Component Stockers USA

USA . 15,321 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,061 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 6,658 parts In-Stock

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Problanco Electronics

Mexico . 4,384 parts In-Stock

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TANS Electronics

Latvia . 4,127 parts In-Stock

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SupplyDigital Components

Austria . 2,797 parts In-Stock

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Corphita

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Türkiye . 163 parts In-Stock

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Overview

Experience superior performance and reliability with the NVD6828NLT4G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and innovation. This power Field Effect Transistor (FET) is designed for a wide range of applications, providing efficient power management solutions. With its single configuration and built-in diode, this FET offers maximum value and benefits to customers. Trust Onsemi to deliver high-quality products that meet your power management needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material provides good insulation and thermal conductivity, making the product durable and efficient.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs allow for efficient current flow with low resistance, making them suitable for high performance applications.

Surface Mount: YES

Being surface mountable makes this FET easy to install and suitable for compact designs.

Maximum Drain-Source On Resistance: 0.031 ohm

With low on-resistance, this FET minimizes power losses and improves overall efficiency of the circuit.

Maximum Operating Temperature: 175 °C

The high operating temperature range of 175 °C allows for reliable performance in various environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVD6828NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

90 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

90 V

Maximum Drain Current (Abs) (ID):

41 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

206 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD6828NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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