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NVD6415ANLT4G-VF01

Onsemi

NVD6415ANLT4G-VF01 by Onsemi

NVD6415ANLT4G-VF01 by Onsemi is a Power FET with 100V DS Breakdown Voltage, 80A IDM, and 79mJ EAS. Ideal for automotive applications due to AEC-Q101 standard compliance and -55 to 175 °C operating temperature range.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

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J2 Sourcing AB

Sweden . 27,781 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 646 parts In-Stock

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Infinite Electronics LLP (Excess)

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Problanco Electronics

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Kulean Microsystems

USA . 7,364 parts In-Stock

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TANS Electronics

Latvia . 2,733 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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Overview

Experience the superior quality and reliability of Onsemi with the NVD6415ANLT4G-VF01 Power FET. This N-channel transistor offers a single configuration with a built-in diode, making it perfect for a wide range of applications. With a high breakdown voltage and low on-resistance, this transistor provides optimal performance and efficiency. Trust in Onsemi's cutting-edge technology and innovative design to deliver exceptional value and benefits to meet your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides good insulation and robustness, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel type allows for efficient switching and control of current flow, making the FET suitable for a wide range of power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances efficiency and protection, making the FET a reliable choice for power circuits.

Maximum Drain-Source On Resistance: 0.056 ohm

Low on-resistance ensures minimal power loss and efficient performance in high-current applications.

Maximum Power Dissipation (Abs): 83 W

High power dissipation rating allows the FET to handle significant power loads without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

Wide operating temperature range makes the FET suitable for use in harsh environments and high-temperature applications.

Maximum Drain Current (ID): 23 A

High drain current rating allows the FET to handle large current loads, making it ideal for power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD6415ANLT4G-VF01 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

79 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

70 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD6415ANLT4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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