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NVD6495NLT4G-VF01

Onsemi

NVD6495NLT4G-VF01 by Onsemi

NVD6495NLT4G-VF01 by Onsemi is a Power FET with 100V DS Breakdown Voltage, 80A IDM, and 0.054 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in high-power systems with its N-CHANNEL configuration and 79mJ EAS rating.

Median Price

$1.280

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,858 parts In-Stock

1+ parts

$1.880

100+ parts

$0.806

1k+ parts

$0.585

10k+ parts

-

1,858

$1.880

$0.806

$0.585

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Rochester

USA . 8,023 parts In-Stock

1+ parts

-

100+ parts

$0.681

1k+ parts

$0.565

10k+ parts

$0.504

8,023

-

$0.681

$0.565

$0.504

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,606 parts In-Stock

1+ parts

$0.529

100+ parts

-

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1,606

$0.529

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Vyrian

USA . 1,796 parts In-Stock

1+ parts

$0.557

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1,796

$0.557

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Chip Stock

USA . 22,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 846 parts In-Stock

1+ parts

$0.501

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846

$0.501

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Corohmni

South Africa . 292 parts In-Stock

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$0.557

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292

$0.557

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Microchip USA

USA . 2,101 parts In-Stock

1+ parts

$3.867

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2,101

$3.867

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Kulean Microsystems

USA . 8,034 parts In-Stock

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8,034

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Infinite Electronics LLP (Excess)

. 5,768 parts In-Stock

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5,768

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Problanco Electronics

Mexico . 3,269 parts In-Stock

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3,269

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Continental Prestige Electronics

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

$0.626

1k+ parts

$0.414

10k+ parts

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2,038

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$0.626

$0.414

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 930 parts In-Stock

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930

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SupplyDigital Components

Austria . 711 parts In-Stock

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711

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TANS Electronics

Latvia . 522 parts In-Stock

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522

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Overview

Discover the NVD6495NLT4G-VF01 by Onsemi, a top-of-the-line Power Field Effect Transistor with unparalleled quality and reliability. As a leading manufacturer in the industry, Onsemi ensures superior performance and durability. This FET is perfect for a wide range of applications, offering customers exceptional value and benefits. Trust in Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NVD6495NLT4G-VF01 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-state resistance and higher efficiency compared to P-channel FETs, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for protection against reverse current flow, improving the reliability of the FET in various circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to drive and control, offering better efficiency and performance in power applications.

Maximum Drain-Source On Resistance: 0.054 ohm

Low on-resistance results in minimal power loss and improved efficiency, making this FET suitable for high current applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD6495NLT4G-VF01 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

79 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.054 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD6495NLT4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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