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NVD6416ANLT4G

Onsemi

NVD6416ANLT4G by Onsemi

NVD6416ANLT4G by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 70A IDM, and 0.074 ohm RDS(on). Ideal for power applications in automotive electronics due to AEC-Q101 standard compliance.

Median Price

$0.235

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 2,500 parts In-Stock

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$0.200

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$0.200

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Vyrian

USA . 1,507 parts In-Stock

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$0.270

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1,507

$0.270

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Cyclops Electronics Ltd

UK . 2,459 parts In-Stock

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2,459

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Digiode

USA . 369 parts In-Stock

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369

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Distributors (Availability)

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Corohmni

South Africa . 407 parts In-Stock

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$0.270

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407

$0.270

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QUARKTWIN TECHNOLOGY LTD

USA . 27,341 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Perfect Parts

USA . 11,200 parts In-Stock

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RC Electronics

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,632 parts In-Stock

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7,632

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Problanco Electronics

Mexico . 5,678 parts In-Stock

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Metaverse IC Inc.

Canada . 5,150 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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TANS Electronics

Latvia . 3,940 parts In-Stock

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Corphita

USA . 1,608 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,545 parts In-Stock

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SupplyDigital Components

Austria . 1,064 parts In-Stock

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UHIMA Technologies

Türkiye . 653 parts In-Stock

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Overview

Discover the power and efficiency of the NVD6416ANLT4G by Onsemi! Crafted with precision by a trusted manufacturer, this N-channel Power FET offers reliability and performance in a variety of applications. With a built-in diode and high breakdown voltage, this enhancement mode transistor delivers optimal functionality. Enhance your projects with its small outline package and high power dissipation capacity. Experience the benefits of seamless operation and maximum energy efficiency with this top-notch semiconductor technology. Upgrade your systems today with the NVD6416ANLT4G!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal performance and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power handling and control in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and reduces the need for additional components, saving space and cost.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, making it suitable for mass production.

Minimum DS Breakdown Voltage: 100 V

Suitable for high-power applications and offers protection against voltage surges.

Package Shape: RECTANGULAR

Optimizes space utilization on the PCB, allowing for compact and efficient designs.

Terminal Form: GULL WING

Enables easy soldering and provides mechanical strength to the connections.

Operating Mode: ENHANCEMENT MODE

Allows for versatile and efficient control of the transistor in various circuit configurations.

Maximum Pulsed Drain Current (IDM): 70 A

Capable of handling high peak currents, making it suitable for power-intensive applications.

Avalanche Energy Rating (EAS): 50 mJ

Provides protection against voltage spikes and transient events, enhancing the reliability of the device.

Maximum Drain Current (Abs) (ID): 19 A

Ensures stable and reliable operation under normal operating conditions.

Maximum Power Dissipation (Abs): 71 W

Capable of dissipating heat effectively, allowing for continuous operation at high power levels.

Package Style (Meter): SMALL OUTLINE

Contributes to compact and space-efficient circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and performance in power switching applications.

Maximum Operating Temperature: 175 °C

Can operate reliably in a wide range of temperature conditions.

Transistor Element Material: SILICON

Provides good electrical performance and reliability in semiconductor devices.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme temperature environments.

Terminal Finish: MATTE TIN

Facilitates good solderability and ensures a reliable electrical connection.

Maximum Drain-Source On Resistance: 0.074 ohm

Results in low power dissipation and efficient power handling.

Terminal Position: SINGLE

Simplifies the layout and connection of the transistor in the circuit.

Case Connection: DRAIN

Enables easy and efficient heat dissipation, enhancing the overall performance of the device.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

Compatible with standard reflow soldering processes, ensuring consistent and reliable solder joints.

Reference Standard: AEC-Q101

Compliance with automotive industry standards ensures high quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD6416ANLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

50 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.074 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

70 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD6416ANLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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