Loading...

NTTFS4824NTWG

Onsemi

NTTFS4824NTWG by Onsemi

NTTFS4824NTWG by Onsemi is a N-channel FET with 30V DS breakdown voltage and 69A max drain current. Ideal for switching applications, it features a built-in diode, 0.0075 ohm max on resistance, and operates in enhancement mode. Suitable for surface mount assembly with a small outline package style.

Median Price

$0.441

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 836 parts In-Stock

1+ parts

-

100+ parts

$0.392

1k+ parts

$0.326

10k+ parts

$0.290

836

-

$0.392

$0.326

$0.290

Verical

USA . 836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.490

10k+ parts

-

836

-

-

$0.490

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,183 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$0.306

-

-

-

Vyrian

USA . 2,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,833

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 682 parts In-Stock

1+ parts

$0.290

100+ parts

-

1k+ parts

-

10k+ parts

-

682

$0.290

-

-

-

Component Stockers USA

USA . 1,197 parts In-Stock

1+ parts

$0.320

100+ parts

$0.310

1k+ parts

-

10k+ parts

-

1,197

$0.320

$0.310

-

-

Corohmni

South Africa . 340 parts In-Stock

1+ parts

$0.322

100+ parts

-

1k+ parts

-

10k+ parts

-

340

$0.322

-

-

-

AZTECH Wire

Italy . 179 parts In-Stock

1+ parts

$18.220

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$18.220

-

-

-

Assy Fe

Spain . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Kulean Microsystems

USA . 6,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,087

-

-

-

-

TANS Electronics

Latvia . 5,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,105

-

-

-

-

Problanco Electronics

Mexico . 4,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,284

-

-

-

-

SupplyDigital Components

Austria . 2,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,612

-

-

-

-

UHIMA Technologies

Türkiye . 730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

730

-

-

-

-

Microchip USA

USA . 297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

297

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the NTTFS4824NTWG from Onsemi, a leading manufacturer known for top-quality Small Signal Field Effect Transistors (FET). This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering a maximum drain current of 8.3 A and a low on-resistance of 0.0075 ohm. With a high breakdown voltage of 30 V and a maximum power dissipation of 46.3 W, this transistor delivers superior performance and reliability. Experience the benefits of enhanced efficiency and precision in your projects with the NTTFS4824NTWG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable, ideal for portable electronic devices.

Polarity or Channel Type: N-CHANNEL

Allows for efficient control of electron flow in the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode within the transistor package.

Transistor Application: SWITCHING

Designed for switching applications, providing fast and reliable performance.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 30 V

Ensures a high level of voltage protection in the circuit.

Maximum Drain Current (Abs) (ID): 69 A

Capable of handling high currents, making it suitable for power applications.

Maximum Power Dissipation (Abs): 46.3 W

Can dissipate significant amounts of power without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high performance and reliability in various operating conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4824NTWG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

69 A

Maximum Drain Current (ID):

8.3 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

255 pF

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4824NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20