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NTTFS003N04CTAG

Onsemi

NTTFS003N04CTAG by Onsemi

NTTFS003N04CTAG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 484A IDM, and 0.0035 ohm RDS(on). Ideal for applications requiring high power dissipation in a small outline package. Operating temperature range from -55 to 175 °C makes it suitable for various industrial uses.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,067 parts In-Stock

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Digiode

USA . 662 parts In-Stock

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AZTECH Wire

Italy . 319 parts In-Stock

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$8.170

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QUARKTWIN TECHNOLOGY LTD

USA . 15,907 parts In-Stock

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Problanco Electronics

Mexico . 7,129 parts In-Stock

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SupplyDigital Components

Austria . 4,728 parts In-Stock

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TANS Electronics

Latvia . 4,413 parts In-Stock

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Kulean Microsystems

USA . 2,606 parts In-Stock

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Corphita

USA . 455 parts In-Stock

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Corohmni

South Africa . 241 parts In-Stock

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UHIMA Technologies

Türkiye . 190 parts In-Stock

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Overview

Experience the superior performance of the NTTFS003N04CTAG by Onsemi, a leading manufacturer in the field of Power FETs. This N-CHANNEL transistor offers enhanced functionality with a built-in diode, making it ideal for various applications. With a high maximum drain current and low on-resistance, this transistor delivers reliable power management solutions. Trust Onsemi's cutting-edge technology and exceptional quality to provide you with the efficiency and reliability you need. Elevate your projects with the NTTFS003N04CTAG and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the FET, ensuring a longer lifespan.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and offer better efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 484 A

With a high pulsed drain current, this FET can handle large power surges without getting damaged.

Maximum Drain-Source On Resistance: 0.0035 ohm

Low on resistance means less power loss and improved efficiency in conducting large currents.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to be used in a wide range of applications without overheating.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS003N04CTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

155 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

103 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

28 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

484 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTTFS003N04CTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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