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NTS4409NT1G

Onsemi

NTS4409NT1G by Onsemi

NTS4409NT1G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.7A Drain Current, and 0.35 ohm On Resistance. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating at up to 150°C, this ENHANCEMENT MODE transistor has GULL WING terminals and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$0.309

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 93,000 parts In-Stock

1+ parts

$0.503

100+ parts

$0.195

1k+ parts

$0.129

10k+ parts

$0.086

93,000

$0.503

$0.195

$0.129

$0.086

Newark

USA . 1,155 parts In-Stock

1+ parts

$0.567

100+ parts

$0.207

1k+ parts

$0.149

10k+ parts

$0.135

1,155

$0.567

$0.207

$0.149

$0.135

DigiKey

USA . 91,774 parts In-Stock

1+ parts

$0.590

100+ parts

$0.232

1k+ parts

$0.157

10k+ parts

-

91,774

$0.590

$0.232

$0.157

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Mouser Electronics

USA . 3,546 parts In-Stock

1+ parts

$0.590

100+ parts

$0.233

1k+ parts

$0.175

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3,546

$0.590

$0.233

$0.175

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Chip1Stop

Japan . 150,000 parts In-Stock

1+ parts

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$0.066

150,000

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$0.066

EBV Elektronik

Germany . 21,000 parts In-Stock

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21,000

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Verical

USA . 15,000 parts In-Stock

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$0.101

15,000

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$0.101

Master Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.309

10k+ parts

$0.138

9,000

-

-

$0.309

$0.138

Rochester

USA . 4,028 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

4,028

-

$0.119

$0.099

$0.088

Farnell

UK . 1,280 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.122

10k+ parts

$0.093

1,280

-

$0.172

$0.122

$0.093

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,338 parts In-Stock

1+ parts

$0.092

100+ parts

-

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2,338

$0.092

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Nova Conductors

Japan . 150 parts In-Stock

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$0.134

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150

$0.134

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Maritex

Poland . 2,284 parts In-Stock

1+ parts

$0.176

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2,284

$0.176

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Bristol Electronics

USA . 1,069 parts In-Stock

1+ parts

$0.450

100+ parts

$0.225

1k+ parts

$0.090

10k+ parts

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1,069

$0.450

$0.225

$0.090

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Chip Stock

USA . 114,500 parts In-Stock

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114,500

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Vyrian

USA . 53,995 parts In-Stock

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53,995

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Flip Electronics

USA . 48,000 parts In-Stock

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48,000

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IBS Electronics

USA . 9,000 parts In-Stock

1+ parts

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$0.434

10k+ parts

$0.193

9,000

-

-

$0.434

$0.193

NAC Semi

USA . 9,000 parts In-Stock

1+ parts

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$0.166

9,000

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$0.166

Cyclops Electronics Ltd

UK . 4,150 parts In-Stock

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4,150

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Speed Components Ltd

Israel . 300 parts In-Stock

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300

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Lantek

USA . 225 parts In-Stock

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225

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EPE Components Inc.

USA . 90 parts In-Stock

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90

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Prism Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 53,830 parts In-Stock

1+ parts

$0.045

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53,830

$0.045

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Corohmni

South Africa . 322 parts In-Stock

1+ parts

$0.065

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322

$0.065

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Corphita

USA . 2,304 parts In-Stock

1+ parts

$0.087

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2,304

$0.087

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Continental Prestige Electronics

USA . 1,814 parts In-Stock

1+ parts

$0.134

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$0.131

1,814

$0.134

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$0.131

Argo Parts USA

USA . 1,699 parts In-Stock

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$0.134

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$0.130

1,699

$0.134

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$0.130

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$0.747

100+ parts

$0.680

1k+ parts

$0.613

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2,000

$0.747

$0.680

$0.613

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

1+ parts

$0.970

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120

$0.970

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Perfect Parts

USA . 238,526 parts In-Stock

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238,526

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Eastek

USA . 120,000 parts In-Stock

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$0.150

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RC Electronics

USA . 71,908 parts In-Stock

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Kepictronics

USA . 65,000 parts In-Stock

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Lixinc

USA . 6,732 parts In-Stock

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Problanco Electronics

Mexico . 6,578 parts In-Stock

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6,578

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TANS Electronics

Latvia . 5,508 parts In-Stock

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5,508

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SupplyDigital Components

Austria . 2,820 parts In-Stock

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2,820

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Kulean Microsystems

USA . 1,698 parts In-Stock

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1,698

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Authorized Procurement Solutions

USA . 1,673 parts In-Stock

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Futuretech Components

Singapore . 503 parts In-Stock

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503

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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Overview

Experience the superior quality and reliability of the NTS4409NT1G by Onsemi, a leading manufacturer in the field of Small Signal Field Effect Transistors. Ideal for switching applications, this N-channel transistor offers enhanced performance in a compact package. With a minimum DS breakdown voltage of 25V and maximum drain current of 0.7A, this transistor delivers efficiency and precision in every use. Trust in Onsemi's expertise and invest in the NTS4409NT1G for seamless operation and optimal results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and efficiency compared to P-channel transistors, making them suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient control of current flow and provides reverse polarity protection in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast response times and low power consumption.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 25 V

The high breakdown voltage ensures reliable operation in various voltage applications, protecting the transistor from damage.

Maximum Drain Current (ID): 0.7 A

With a high drain current rating, this transistor can handle significant current loads without overheating or failing.

Maximum Power Dissipation (Abs): 0.33 W

The low power dissipation ensures the transistor operates efficiently and does not generate excessive heat during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low on-resistance, and excellent efficiency, making it ideal for various applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for operation in demanding environments without compromising performance.

Maximum Drain-Source On Resistance: 0.35 ohm

The low on-resistance results in minimal power loss and heat dissipation, ensuring efficient operation of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTS4409NT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

.7 A

Maximum Drain Current (ID):

.7 A

Maximum Drain-Source On Resistance:

.35 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTS4409NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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