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NTS4101PT1

Onsemi

NTS4101PT1 by Onsemi

NTS4101PT1 by Onsemi is a P-CHANNEL FET for switching applications. It features a 20V DS breakdown voltage, 1.37A max drain current, and 0.12 ohm max on-resistance. With a small outline package and GULL WING terminals, it operates in enhancement mode up to 150 °C.

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Vyrian

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Digiode

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 668 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,289 parts In-Stock

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SupplyDigital Components

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TANS Electronics

Latvia . 2,389 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

Türkiye . 577 parts In-Stock

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Corohmni

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Corphita

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Kulean Microsystems

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Overview

Unleash the power of innovation with the NTS4101PT1 by Onsemi. Crafted with precision and quality, this P-channel small signal field effect transistor offers unmatched performance in switching applications. With a single configuration and built-in diode, this transistor provides seamless operation and reliability. Its compact package and surface mount design make it ideal for space-constrained projects. Experience enhanced efficiency and power with the NTS4101PT1, setting new standards in the world of semiconductor technology. Elevate your projects to new heights with Onsemi's cutting-edge transistor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low leakage current and high noise immunity, making this transistor suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse current flow, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency.

Surface Mount: YES

Being surface mountable makes this transistor easy to integrate into compact electronic devices, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V ensures reliable operation and protection against voltage spikes or transients.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and low on-resistance, making them ideal for efficient switching applications.

Maximum Drain Current (Abs) (ID): 1.37 A

With a maximum drain current of 1.37A, this transistor can handle high current loads, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 0.329 W

The low maximum power dissipation of 0.329W ensures efficient power handling, reducing heat generation and improving reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this transistor a dependable choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperatures, ensuring stable performance in demanding environments.

Transistor Element Material: SILICON

Silicon-based transistors are known for their high switching speeds and low on-resistance, making this transistor suitable for high-performance applications.

Terminal Finish: Tin/Lead (Sn80Pb20)

The tin/lead terminal finish provides reliable electrical connections and solderability, ensuring easy and secure installation of the transistor.

Maximum Drain-Source On Resistance: 0.12 ohm

The low drain-source on resistance of 0.12 ohms reduces power losses and improves efficiency, making this transistor an optimal choice for switching applications.

Maximum Feedback Capacitance (Crss): 85 pF

The maximum feedback capacitance of 85pF helps in reducing signal distortion and improving the overall performance of the transistor in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTS4101PT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.37 A

Maximum Drain Current (ID):

1.37 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

85 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTS4101PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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