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NTP4813NLT4G

Onsemi

NTP4813NLT4G by Onsemi

NTP4813NLT4G by Onsemi is an N-CHANNEL FET with 51A max drain current and 60W max power dissipation. Ideal for high-power applications, it operates up to 175 °C, making it suitable for industrial and automotive systems requiring robust performance.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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Digiode

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TANS Electronics

Latvia . 3,840 parts In-Stock

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Problanco Electronics

Mexico . 3,827 parts In-Stock

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SupplyDigital Components

Austria . 1,608 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 857 parts In-Stock

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Kulean Microsystems

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Corohmni

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Overview

Unleash the power of connectivity with Onsemi's NTP4813NLT4G Power Field Effect Transistor. Designed for high-performance applications, this N-CHANNEL FET offers unparalleled quality and reliability. Whether you're powering up a motor control system or enhancing your audio amplification setup, this transistor delivers exceptional performance with a maximum drain current of 51 A and a power dissipation of 60 W. Trust in Onsemi's cutting-edge technology to take your projects to the next level. Experience the difference with the NTP4813NLT4G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high input impedance, making them suitable for applications requiring high-speed switching and low on-resistance.

Configuration: SINGLE

The single configuration simplifies system design and integration, making it easier to use in various circuit setups.

Maximum Drain Current (Abs) (ID): 51 A

With a high maximum drain current, this FET can handle large power loads effectively, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 60 W

The high power dissipation capability allows the FET to operate efficiently under high power conditions, ensuring reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, making it a preferred choice for power electronics applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperature environments, ensuring stable performance in demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTP4813NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

51 A

Maximum Drain Current (ID):

51 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

NTP4813NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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