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NTP4302G

Onsemi

NTP4302G by Onsemi

NTP4302G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 175A IDM, and 0.0093 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. The package is RECTANGULAR with THROUGH-HOLE terminals and can handle up to 80W power dissipation.

Median Price

$7.026

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 27 parts In-Stock

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$13.670

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$13.670

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Rochester

USA . 700 parts In-Stock

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$0.383

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$0.318

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$0.283

700

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$0.383

$0.318

$0.283

Distributors (In-Stock)

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Digiode

USA . 577 parts In-Stock

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$0.298

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Vyrian

USA . 7,614 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 171 parts In-Stock

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$0.283

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Corohmni

South Africa . 91 parts In-Stock

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$0.314

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91

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 8,173 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,408 parts In-Stock

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SupplyDigital Components

Austria . 6,712 parts In-Stock

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TANS Electronics

Latvia . 6,422 parts In-Stock

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Problanco Electronics

Mexico . 1,143 parts In-Stock

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Perfect Parts

USA . 329 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 27 parts In-Stock

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UHIMA Technologies

Türkiye . 20 parts In-Stock

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Overview

Discover the NTP4302G by Onsemi, a high-quality Power Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL FET is perfect for switching applications. With a built-in diode and an impressive 175A maximum pulsed drain current, this transistor delivers outstanding power dissipation and efficiency. Whether you're looking to enhance your electronic projects or improve your design processes, the NTP4302G provides exceptional value and benefits that will elevate your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection to the internal components of the Power FET.

Polarity or Channel Type: N-CHANNEL

N-Channel polarity allows for efficient current flow and enhanced performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making this Power FET a convenient choice for applications that require this feature.

Transistor Application: SWITCHING

Designed specifically for switching applications, this Power FET delivers optimal performance and reliability in controlling power flow.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this Power FET can withstand high temperature environments, ensuring stable operation under challenging conditions.

Maximum Drain-Source On Resistance: 0.0093 ohm

The low on-resistance of this Power FET results in minimal power loss and efficient operation, making it ideal for high-current applications.

Maximum Power Dissipation (Abs): 80 W

Capable of dissipating up to 80 watts of power, this Power FET can handle high power loads without overheating, ensuring long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTP4302G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

74 A

Maximum Drain-Source On Resistance:

.0093 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP4302G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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