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NTP4804NG

Onsemi

NTP4804NG by Onsemi

NTP4804NG by Onsemi is a N-CHANNEL FET with 133A ID and 120W power dissipation. It operates in enhancement mode with a max temp of 175 °C. Ideal for high-power applications requiring efficient switching and control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,130 parts In-Stock

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Digiode

USA . 1,578 parts In-Stock

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TANS Electronics

Latvia . 7,497 parts In-Stock

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7,497

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SupplyDigital Components

Austria . 6,776 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,991 parts In-Stock

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Kulean Microsystems

USA . 2,192 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 861 parts In-Stock

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Problanco Electronics

Mexico . 701 parts In-Stock

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UHIMA Technologies

Türkiye . 682 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Power up with the NTP4804NG by Onsemi, a top-quality N-CHANNEL Power FET that delivers unrivaled performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this FET is perfect for a wide range of applications. With a maximum drain current of 133A and a power dissipation of 120W, this Enhancement Mode transistor offers exceptional value and efficiency. Say goodbye to power limitations and hello to limitless possibilities with the NTP4804NG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have better performance and efficiency compared to P-CHANNEL FETs, making this product a good choice for high-power applications.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and reduces complexity, making it easier to integrate this FET into different electronic systems.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs are easier to use and have faster switching speeds, making this product suitable for applications that require quick response times.

Maximum Drain Current (ID): 133 A

With a high maximum drain current capacity of 133 A, this FET can handle large amounts of current, making it ideal for high-power applications.

Maximum Power Dissipation: 120 W

The high maximum power dissipation of 120 W allows this FET to handle high levels of power without overheating, ensuring reliable operation in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology provides good performance and efficiency, making this product a reliable choice for various electronic applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175 °C, this FET can withstand high temperature environments, ensuring stable operation in harsh conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTP4804NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

133 A

Maximum Drain Current (ID):

133 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

NTP4804NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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