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NTP4302

Onsemi

NTP4302 by Onsemi

NTP4302 by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 175A IDM, and 0.0093 ohm RDS. Ideal for SWITCHING applications due to its 80W Pdiss, ENHANCEMENT MODE operation, and built-in DIODE. Package: PLASTIC/EPOXY RECTANGULAR with THROUGH-HOLE terminals.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,867 parts In-Stock

1+ parts

-

100+ parts

$0.317

1k+ parts

$0.263

10k+ parts

$0.235

7,867

-

$0.317

$0.263

$0.235

Farnell

UK . 7,867 parts In-Stock

1+ parts

-

100+ parts

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$0.300

7,867

-

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$0.300

Verical

USA . 7,867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.293

7,867

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-

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$0.293

Distributors (In-Stock)

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Digiode

USA . 552 parts In-Stock

1+ parts

$0.247

100+ parts

-

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552

$0.247

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Vyrian

USA . 6,388 parts In-Stock

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6,388

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Distributors (Availability)

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Corphita

USA . 1,395 parts In-Stock

1+ parts

$0.234

100+ parts

-

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1,395

$0.234

-

-

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Corohmni

South Africa . 408 parts In-Stock

1+ parts

$0.260

100+ parts

-

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408

$0.260

-

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-

Component Stockers USA

USA . 5,263 parts In-Stock

1+ parts

$0.270

100+ parts

$0.250

1k+ parts

$0.230

10k+ parts

-

5,263

$0.270

$0.250

$0.230

-

AZTECH Wire

Italy . 510 parts In-Stock

1+ parts

$10.920

100+ parts

-

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510

$10.920

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 28,121 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Continental Prestige Electronics

USA . 7,867 parts In-Stock

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$0.238

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7,867

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$0.238

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A-Z Elektronik GmbH

Germany . 6,371 parts In-Stock

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6,371

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Problanco Electronics

Mexico . 6,148 parts In-Stock

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Kulean Microsystems

USA . 5,955 parts In-Stock

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5,955

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SupplyDigital Components

Austria . 5,332 parts In-Stock

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5,332

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TANS Electronics

Latvia . 5,280 parts In-Stock

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5,280

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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312

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Overview

Looking for a reliable and high-quality Power FET for your switching applications? Look no further than the NTP4302 by Onsemi. With its N-CHANNEL configuration and built-in diode, this transistor offers superior performance and efficiency. Whether you're working on industrial equipment or automotive systems, this transistor can handle it all with ease. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds your expectations. Upgrade your projects today with the NTP4302 and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility leading to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power control.

Minimum DS Breakdown Voltage: 30 V

A higher breakdown voltage provides a safety margin for the device to handle higher voltages.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to mount and integrate into existing circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections to the circuit board, reducing the risk of disconnection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally-off devices which offer added safety in certain applications.

Maximum Pulsed Drain Current (IDM): 175 A

High pulsed drain current capability allows for handling of short bursts of high current, ideal for demanding applications.

Avalanche Energy Rating (EAS): 722 mJ

High avalanche energy rating indicates the ability of the transistor to withstand sudden voltage spikes, increasing reliability.

Maximum Drain Current (Abs) (ID): 74 A

High maximum drain current ensures the transistor can handle the required load current without overheating.

No. of Terminals: 3

Compact design with only 3 terminals allows for easy integration into small circuit layouts.

Maximum Power Dissipation (Abs): 80 W

High power dissipation capability ensures the transistor can handle high power applications without damage.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for easy and secure mounting onto heat sinks, improving thermal conductivity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds.

Maximum Operating Temperature: 150 °C

High operating temperature rating allows the transistor to function reliably in demanding environments.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability in power applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability for easy assembly onto circuit boards.

Maximum Drain-Source On Resistance: 0.0093 ohm

Low drain-source on resistance minimizes power loss and improves efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and reduces the chance of connection errors.

Case Connection: DRAIN

Drain connection offers stable and secure connection to the circuit, ensuring reliable performance.

Peak Reflow Temperature °C: 235

High peak reflow temperature allows for easy and reliable soldering during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTP4302 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

74 A

Maximum Drain-Source On Resistance:

.0093 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP4302 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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