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NTP45N06

Onsemi

NTP45N06 by Onsemi

NTP45N06 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 45A Drain Current, and 0.026 ohm On Resistance. Ideal for SWITCHING applications due to its 150A Pulsed Drain Current and 125W Power Dissipation capabilities in ENHANCEMENT MODE operation.

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,444 parts In-Stock

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Digiode

USA . 1,168 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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AZTECH Wire

Italy . 201 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 7,957 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,109 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,867 parts In-Stock

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Kulean Microsystems

USA . 5,383 parts In-Stock

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SupplyDigital Components

Austria . 3,346 parts In-Stock

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Problanco Electronics

Mexico . 2,151 parts In-Stock

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Corphita

USA . 1,591 parts In-Stock

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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Corohmni

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Overview

Unleash the power of innovation with the NTP45N06 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are designed for efficiency and reliability. Ideal for switching applications, this N-CHANNEL transistor offers a built-in diode for added convenience. With a high DS breakdown voltage of 60V and a maximum drain current of 45A, the NTP45N06 provides unmatched performance and durability. Experience seamless operation and superior functionality with Onsemi's cutting-edge technology. Elevate your projects with the NTP45N06 today.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the FET suitable for a variety of applications.

Polarity or Channel Type - N-CHANNEL

N-channel FETs typically offer higher efficiency and faster switching speeds compared to P-channel FETs, making them ideal for many power applications.

Minimum DS Breakdown Voltage - 60 V

With a minimum breakdown voltage of 60V, this FET can handle high voltage applications with ease, ensuring reliable performance.

Maximum Pulsed Drain Current (IDM) - 150 A

The high pulsed drain current rating of 150A allows the FET to handle large current spikes, making it suitable for demanding applications.

Maximum Power Dissipation (Abs) - 125 W

The high power dissipation rating of 125W ensures that the FET can handle high power levels without overheating, making it a reliable choice for power applications.

Maximum Operating Temperature - 175 °C

With a maximum operating temperature of 175 °C, this FET can operate in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance - 0.026 ohm

The low on-resistance of 0.026 ohms ensures efficient power handling and minimal power loss, making this FET ideal for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP45N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP45N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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