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NTMFS5C404NLT3G

Onsemi

NTMFS5C404NLT3G by Onsemi

NTMFS5C404NLT3G by Onsemi is a single N-channel power FET with a max drain current of 339A and power dissipation of 167W. Utilizes metal-oxide semiconductor technology, operates up to 150 °C, ideal for high-power applications requiring efficient switching and control.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,271 parts In-Stock

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NexGen Digital

USA . 4,865 parts In-Stock

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Digiode

USA . 1,464 parts In-Stock

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AZTECH Wire

Italy . 47 parts In-Stock

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Microchip USA

USA . 9,166 parts In-Stock

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SupplyDigital Components

Austria . 5,961 parts In-Stock

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Kulean Microsystems

USA . 3,501 parts In-Stock

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TANS Electronics

Latvia . 2,614 parts In-Stock

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Problanco Electronics

Mexico . 1,781 parts In-Stock

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UHIMA Technologies

Türkiye . 786 parts In-Stock

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Corphita

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Corohmni

South Africa . 50 parts In-Stock

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Overview

Enhance your power management systems with the NTMFS5C404NLT3G from Onsemi. Known for their top-notch quality and reliability, Onsemi brings you this N-CHANNEL Power FET that offers exceptional performance in a variety of applications. With a maximum drain current of 339A and a power dissipation of 167W, this FET is designed to deliver superior efficiency and durability. Whether you're working on industrial machinery, automotive systems, or renewable energy projects, this FET provides the value, benefits, and advantages you need to elevate your designs to the next level. Experience the difference with Onsemi's NTMFS5C404NLT3G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and low on-resistance, making them ideal for high power applications.

Configuration: SINGLE

Single configuration FETs are easy to control and require less complex circuitry, making them suitable for simpler power systems.

Surface Mount: YES

Surface mount FETs are space-saving and offer improved thermal performance due to direct contact with the PCB.

Maximum Drain Current (Abs) (ID): 339 A

With a high maximum drain current, this FET can handle large amounts of power without overheating or failing.

Maximum Power Dissipation (Abs): 167 W

The high power dissipation capability allows this FET to operate efficiently under heavy loads, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good switching speed and low gate drive requirements, enhancing the overall performance of the FET.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET is suitable for applications where temperature fluctuations are common.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Maximum Time At Peak Reflow Temperature (s): 30

Quick peak reflow time ensures proper soldering of the FET to the PCB, reducing manufacturing time and cost.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C allows for efficient soldering without damaging the FET or the PCB.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C404NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

339 A

Maximum Drain Current (ID):

339 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS5C404NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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