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NTMFS4H02NFT3G

Onsemi

NTMFS4H02NFT3G by Onsemi

NTMFS4H02NFT3G by Onsemi is a N-CHANNEL FET with 193A max drain current and 83W power dissipation. Ideal for high-power applications, it operates at up to 150 °C, making it suitable for demanding environments requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,274 parts In-Stock

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Digiode

USA . 1,082 parts In-Stock

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AZTECH Wire

Italy . 583 parts In-Stock

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$19.870

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QUARKTWIN TECHNOLOGY LTD

USA . 28,410 parts In-Stock

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SupplyDigital Components

Austria . 6,081 parts In-Stock

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TANS Electronics

Latvia . 5,915 parts In-Stock

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Problanco Electronics

Mexico . 4,593 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 856 parts In-Stock

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Kulean Microsystems

USA . 457 parts In-Stock

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UHIMA Technologies

Türkiye . 239 parts In-Stock

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Unleash the power of innovation with the NTMFS4H02NFT3G by Onsemi. This top-of-the-line Power Field Effect Transistor boasts unparalleled quality and reliability, backed by the renowned manufacturer, Onsemi. Ideal for a wide range of applications, this N-CHANNEL FET offers exceptional performance and efficiency. Experience seamless operation and enhanced functionality with the NTMFS4H02NFT3G, delivering unmatched value and benefits to customers. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors offer lower on-resistance and better efficiency compared to P-CHANNEL transistors, making this product a good choice for high power applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easier installation, making this product convenient for users.

Surface Mount: YES

Surface mount technology saves space and allows for high density mounting, making this product suitable for compact electronic devices.

Maximum Drain Current (Abs) (ID): 193 A

With a high maximum drain current, this FET can handle large current requirements, making it ideal for high power applications.

Maximum Power Dissipation (Abs): 83 W

The high power dissipation capability ensures the FET can operate under heavy load conditions without overheating, making it reliable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low gate drive requirements, enhancing the performance of this FET in various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without degrading performance, making it suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and prevents oxidation, ensuring reliable connections and longevity of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature allows for quick and efficient soldering processes, saving time during manufacturing.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this FET can withstand the soldering process without damage, ensuring the integrity of the component during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4H02NFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

193 A

Maximum Drain Current (ID):

193 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4H02NFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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