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NTMFS4H01NT3G

Onsemi

NTMFS4H01NT3G by Onsemi

NTMFS4H01NT3G by Onsemi is a N-CHANNEL FET with 334A ID, 125W power dissipation, and 150 °C max operating temp. Ideal for high-power applications requiring efficient switching in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 15,000 parts In-Stock

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Vyrian

USA . 8,868 parts In-Stock

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Digiode

USA . 617 parts In-Stock

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AZTECH Wire

Italy . 367 parts In-Stock

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$12.690

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Ampacity Inc.

Singapore . 1,312 parts In-Stock

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$34.050

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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TANS Electronics

Latvia . 8,262 parts In-Stock

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SupplyDigital Components

Austria . 7,746 parts In-Stock

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Kulean Microsystems

USA . 6,356 parts In-Stock

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Problanco Electronics

Mexico . 5,378 parts In-Stock

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UHIMA Technologies

Türkiye . 851 parts In-Stock

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Corphita

USA . 419 parts In-Stock

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Corohmni

South Africa . 111 parts In-Stock

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Overview

Experience the power of reliable performance with the NTMFS4H01NT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a variety of applications. From industrial to automotive, this N-CHANNEL FET offers exceptional value with its single configuration and high maximum drain current of 334 A. Trust in the METAL-OXIDE SEMICONDUCTOR technology and matte tin terminal finish for superior durability and efficiency. Upgrade your projects with the NTMFS4H01NT3G and unlock endless possibilities today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower on-state resistance, making them more efficient for high power applications.

Configuration: SINGLE

Single configuration makes it easier to handle and integrate into circuits.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB design.

Maximum Drain Current (Abs) (ID): 334 A

High maximum drain current allows for handling large current loads.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capability ensures reliability in high power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability for power applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance enables operation in diverse environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity for reliable connections.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time reduces stress on components during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability in assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4H01NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

334 A

Maximum Drain Current (ID):

334 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4H01NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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