Loading...

NTMFS4H01NFT1G

Onsemi

NTMFS4H01NFT1G by Onsemi

NTMFS4H01NFT1G by Onsemi is a N-CHANNEL FET with 334A max drain current and 125W power dissipation. Ideal for high-power applications, it operates at up to 150 °C and features surface mount configuration for efficient heat dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 49,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

49,000

-

-

-

-

Vyrian

USA . 13,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,365

-

-

-

-

Digiode

USA . 1,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$9.450

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$9.450

-

-

-

Perfect Parts

USA . 19,566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,566

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,733

-

-

-

-

TANS Electronics

Latvia . 4,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,344

-

-

-

-

Kepictronics

USA . 3,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,455

-

-

-

-

Problanco Electronics

Mexico . 3,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,348

-

-

-

-

SupplyDigital Components

Austria . 2,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

-

-

-

-

Corphita

USA . 1,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,348

-

-

-

-

UHIMA Technologies

Türkiye . 512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

512

-

-

-

-

Corohmni

South Africa . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Kulean Microsystems

USA . 460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

460

-

-

-

-

Overview

Enhance your power management systems with the NTMFS4H01NFT1G by Onsemi, a top-quality N-CHANNEL Power FET that promises reliability and efficiency. Manufactured by Onsemi, a trusted name in semiconductor technology, this FET is designed for high-performance applications where power dissipation and current handling are crucial. With a maximum drain current of 334A and a power dissipation of 125W, this FET offers exceptional value and benefits to customers seeking superior performance and stability in their power systems. Upgrade your electronics today with the NTMFS4H01NFT1G and experience the difference in power management.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high-power applications due to their excellent performance and efficiency.

Configuration: SINGLE

The single configuration simplifies the design and implementation of the circuit, making it more reliable.

Surface Mount: YES

Surface mount technology allows for space-saving designs and efficient manufacturing processes.

Maximum Drain Current (Abs): 334 A

With a high maximum drain current, this FET can handle heavy loads with ease, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 125 W

The high maximum power dissipation ensures that the FET can operate efficiently without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability in a wide range of operating conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environments and high-temperature applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good electrical conductivity and reliability in various environmental conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures that the FET is not subjected to excessive thermal stress during manufacturing processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for reliable soldering and ensures proper bonding of the FET to the circuit board.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4H01NFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

334 A

Maximum Drain Current (ID):

334 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4H01NFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20