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NTMFS4983NFT3G

Onsemi

NTMFS4983NFT3G by Onsemi

NTMFS4983NFT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 320A IDM, 101mJ EAS, and 0.0031 ohm RDS(ON). Operating in ENHANCEMENT MODE, it has a max temp of 150°C and DUAL terminal position.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

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Vyrian

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 1,580 parts In-Stock

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$0.050

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Aztec Data Supply Inc.

USA . 81 parts In-Stock

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$1.130

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AZTECH Wire

Italy . 468 parts In-Stock

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$16.798

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Semicontronic

India . 1,336 parts In-Stock

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$27.050

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$26.374

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$26.238

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RC Electronics

USA . 72,463 parts In-Stock

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Lixinc

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Kulean Microsystems

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Continental Prestige Electronics

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SupplyDigital Components

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TANS Electronics

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Argo Parts USA

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Corphita

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Robosynatics

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Lucentia Tech

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,707 parts In-Stock

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Corohmni

South Africa . 409 parts In-Stock

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UHIMA Technologies

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Bastille Electronics

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Overview

Unleash the power of innovation with the NTMFS4983NFT3G by Onsemi. Crafted with precision and expertise, this Power FET offers unparalleled performance in switching applications. With a high DS breakdown voltage and maximum pulsed drain current, this N-CHANNEL transistor is designed to meet your power needs efficiently. Whether you're looking to optimize energy consumption or enhance system reliability, this single configuration transistor with built-in diode delivers exceptional value and benefits. Trust Onsemi for cutting-edge technology that drives success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making this FET a reliable choice.

Polarity or Channel Type: N-CHANNEL

The N-Channel design allows for efficient switching and control of current flow, enhancing performance in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature simplifies circuit design and offers additional protection against reverse currents, making this FET versatile and user-friendly.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET offers fast response times and low power consumption, making it ideal for efficient power management.

Surface Mount: YES

The surface mount capability enables easy installation and space-saving in cramped electronic devices, making this FET suitable for compact designs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without experiencing damage, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact form factor and efficient heat dissipation, allowing for versatile placement in electronic circuits.

Terminal Form: FLAT

The flat terminal form provides secure connections and ease of soldering, ensuring reliable performance in various electronic applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control of current flow, improving efficiency and performance in switching applications.

Maximum Pulsed Drain Current (IDM): 320 A

With a high pulsed drain current rating of 320A, this FET can handle sudden surges of current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 101 mJ

The high avalanche energy rating of 101mJ provides protection against voltage spikes and transient events, ensuring long-term reliability in challenging environments.

Maximum Drain Current (Abs) (ID): 106 A

With a maximum drain current rating of 106A, this FET can handle high current loads, making it suitable for demanding applications.

No. of Terminals: 5

The 5 terminal configuration offers flexibility in circuit design and connection options, making this FET versatile for a range of applications.

Maximum Power Dissipation (Abs): 38 W

With a maximum power dissipation of 38W, this FET can effectively manage heat dissipation, ensuring stable performance under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving benefits and efficient heat dissipation, making this FET suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET offers high performance and reliability in switching applications, ensuring consistent operation.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high-temperature environments, making it suitable for industrial applications.

Transistor Element Material: SILICON

The silicon material used for the transistor element provides stability and reliability, ensuring long-term performance in various electronic circuits.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish offers corrosion resistance and reliable soldering connections, ensuring durable performance in different environmental conditions.

Maximum Drain Current (ID): 22 A

With a maximum drain current of 22A, this FET can handle moderate current loads, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.0031 ohm

The low drain-source on resistance of 0.0031 ohm minimizes power loss and improves efficiency in circuit operation, making this FET an energy-efficient choice.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit layout and connection options, providing versatility in different electronic applications.

Case Connection: DRAIN

The drain case connection offers easy integration and efficient heat dissipation, making this FET a reliable and practical choice for various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4983NFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

101 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

106 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4983NFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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