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NTMFS4983NFT1G

Onsemi

NTMFS4983NFT1G by Onsemi

NTMFS4983NFT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 320A IDM, and 0.0031 ohm RDS(ON). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 150 °C max temp.

Median Price

$0.579

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 13,234 parts In-Stock

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$0.643

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$0.574

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$0.574

Rochester

USA . 13,234 parts In-Stock

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$0.515

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$0.428

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$0.381

13,234

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$0.515

$0.428

$0.381

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Chip Stock

USA . 11,458 parts In-Stock

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Vyrian

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Flip Electronics

USA . 4,500 parts In-Stock

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K-1 Technologies

USA . 3,604 parts In-Stock

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Digiode

USA . 1,670 parts In-Stock

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Prism Electronics

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AZTECH Wire

Italy . 957 parts In-Stock

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$15.050

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957

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Component Stockers USA

USA . 499 parts In-Stock

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$99.990

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499

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 6,044 parts In-Stock

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SupplyDigital Components

Austria . 3,190 parts In-Stock

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Microchip USA

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Kulean Microsystems

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Kepictronics

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TANS Electronics

Latvia . 1,440 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Futuretech Components

Singapore . 505 parts In-Stock

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UHIMA Technologies

Türkiye . 470 parts In-Stock

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Corohmni

South Africa . 450 parts In-Stock

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Corphita

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Problanco Electronics

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Overview

Experience the power and efficiency of the NTMFS4983NFT1G by Onsemi, a top-of-the-line Power FET for all your switching needs. With Onsemi's reputation for quality and innovation, this N-channel transistor offers a single configuration with a built-in diode, making it perfect for a wide range of applications. From its high pulsing current capability to its low on-resistance, this transistor delivers exceptional performance and reliability. Trust Onsemi to provide you with the best in power semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and mechanical protection for the FET, making it durable and reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics and lower on-resistance compared to P-channel FETs, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against reverse voltage spikes, enhancing the reliability of the switching operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and efficient switching performance with minimal power loss.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and enabling automated assembly, making it suitable for mass production.

Maximum Drain Current (ID): 22 A

With a high maximum drain current rating, this FET can handle larger current loads without overheating or degrading performance.

Maximum Power Dissipation (Abs): 38 W

The high power dissipation capability ensures that the FET can operate under heavy load conditions without exceeding its thermal limits, increasing its reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4983NFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

101 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

106 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4983NFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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