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NTMFS4939NT3G

Onsemi

NTMFS4939NT3G by Onsemi

NTMFS4939NT3G by Onsemi is an N-CHANNEL FET with a 30V DS Breakdown Voltage and 159A Pulsed Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 0.008 ohm RDS(on), and operates in ENHANCEMENT MODE.

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1k+

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Vyrian

USA . 7,398 parts In-Stock

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Digiode

USA . 2,135 parts In-Stock

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AZTECH Wire

Italy . 657 parts In-Stock

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$11.800

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Component Stockers USA

USA . 695 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 8,173 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 4,930 parts In-Stock

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Problanco Electronics

Mexico . 2,132 parts In-Stock

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SupplyDigital Components

Austria . 2,107 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 731 parts In-Stock

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Corohmni

South Africa . 254 parts In-Stock

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Kepictronics

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Overview

Upgrade your power systems with the NTMFS4939NT3G by Onsemi, a high-quality N-CHANNEL Power FET designed for switching applications. With a single configuration and built-in diode, this transistor offers enhanced performance and reliability. Ideal for a wide range of industrial and automotive applications, this product provides customers with superior efficiency and power handling capabilities. Trust in Onsemi's reputation for excellence and invest in the NTMFS4939NT3G for all your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower ON resistance than P-channel FETs, making them a good choice for high efficiency applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in power control circuits.

Surface Mount: YES

Surface mount packaging allows for easy and compact PCB integration, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 159 A

High pulsed drain current rating ensures reliable operation in high power applications with short duration pulses.

Avalanche Energy Rating (EAS): 48 mJ

Avalanche energy rating indicates the ability to withstand high current and voltage transients, making it suitable for rugged environments.

Maximum Drain-Source On Resistance: 0.008 ohm

Low ON resistance results in minimal power loss and heat generation, leading to high efficiency and reduced operating costs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, ensuring stable operation under varying conditions.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can withstand elevated temperatures without performance degradation, making it suitable for demanding environments.

Terminal Finish: Tin (Sn)

Tin terminal finish offers good solderability and corrosion resistance, ensuring reliable connections for long-term use.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4939NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

53 A

Maximum Drain Current (ID):

9.3 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

159 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4939NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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