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NTMFS4939NT1G

Onsemi

NTMFS4939NT1G by Onsemi

NTMFS4939NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 159A IDM. Ideal for SWITCHING applications, it features 0.008 ohm RDS(ON) and 48mJ EAS rating.

Median Price

$0.567

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 107 parts In-Stock

1+ parts

$0.750

100+ parts

$0.655

1k+ parts

$0.357

10k+ parts

$0.278

107

$0.750

$0.655

$0.357

$0.278

Chip1Stop

Japan . 590 parts In-Stock

1+ parts

$2.360

100+ parts

$0.783

1k+ parts

$0.623

10k+ parts

-

590

$2.360

$0.783

$0.623

-

Rochester

USA . 3,966 parts In-Stock

1+ parts

-

100+ parts

$0.342

1k+ parts

$0.283

10k+ parts

$0.253

3,966

-

$0.342

$0.283

$0.253

Verical

USA . 3,016 parts In-Stock

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$0.384

10k+ parts

$0.316

3,016

-

-

$0.384

$0.316

Distributors (In-Stock)

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Digiode

USA . 2,164 parts In-Stock

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$0.266

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2,164

$0.266

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Vyrian

USA . 8,005 parts In-Stock

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8,005

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Cyclops Electronics Ltd

UK . 2,160 parts In-Stock

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2,160

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Prism Electronics

USA . 35 parts In-Stock

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35

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Corphita

USA . 1,683 parts In-Stock

1+ parts

$0.252

100+ parts

-

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-

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1,683

$0.252

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-

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Corohmni

South Africa . 142 parts In-Stock

1+ parts

$0.258

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-

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142

$0.258

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Perfect Parts

USA . 34,266 parts In-Stock

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34,266

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Metaverse IC Inc.

Canada . 31,500 parts In-Stock

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Continental Prestige Electronics

USA . 21,706 parts In-Stock

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$0.213

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21,706

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$0.213

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SupplyDigital Components

Austria . 6,823 parts In-Stock

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6,823

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Assy Fe

Spain . 6,000 parts In-Stock

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6,000

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TANS Electronics

Latvia . 4,126 parts In-Stock

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Kulean Microsystems

USA . 3,378 parts In-Stock

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3,378

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Problanco Electronics

Mexico . 2,787 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,093 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,620 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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1,500

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UHIMA Technologies

Türkiye . 696 parts In-Stock

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696

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GreenTree Electronics

Israel . 590 parts In-Stock

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590

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Authorized Procurement Solutions

USA . 590 parts In-Stock

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590

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Futuretech Components

Singapore . 506 parts In-Stock

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506

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Overview

Enhance the performance of your electronic devices with the NTMFS4939NT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power FETs for various applications, including switching functions. With a single design featuring a built-in diode, this N-channel transistor offers reliability and efficiency. Experience the benefits of its high power dissipation, low on-resistance, and enhanced mode operation. Upgrade your technology with Onsemi's NTMFS4939NT1G for superior performance and durability. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high-power applications, making this product suitable for switching high currents.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching speeds and protection against reverse current flow, enhancing the efficiency and reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and reliability when used in switching circuits.

Surface Mount: YES

Surface mount package makes it easy to integrate this FET into compact electronic devices and circuit boards.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage allows for safe operation at higher voltage levels, making this FET suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 159 A

The high pulsed drain current rating indicates that this FET can handle short-term surges in current, making it ideal for high-power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, ensuring reliability in harsh operating conditions.

Maximum Drain-Source On Resistance: 0.008 ohm

Low on-resistance results in minimal power loss and heat generation, improving overall efficiency of the circuit.

Case Connection: DRAIN

The drain connection simplifies the circuit design and layout, making it easier to integrate this FET into different applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4939NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

53 A

Maximum Drain Current (ID):

9.3 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

159 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4939NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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