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NTMFS4899NFT1G

Onsemi

NTMFS4899NFT1G by Onsemi

NTMFS4899NFT1G by Onsemi is a N-CHANNEL FET for SWITCHING applications. It features 30V DS Breakdown Voltage, 188A Pulsed Drain Current, and 0.0075 ohm Drain-Source On Resistance. With a max power dissipation of 48W, it operates in temperatures ranging from -55 to 150 °C.

Median Price

$2.451

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip1Stop

Japan . 14 parts In-Stock

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$4.280

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Rochester

USA . 478 parts In-Stock

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$0.622

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$0.517

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$0.461

478

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$0.517

$0.461

Distributors (In-Stock)

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Digiode

USA . 269 parts In-Stock

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$0.484

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Vyrian

USA . 5,091 parts In-Stock

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R&J Components

USA . 984 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 246 parts In-Stock

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$0.433

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Corphita

USA . 1,063 parts In-Stock

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$0.459

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$0.459

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Corohmni

South Africa . 218 parts In-Stock

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$0.510

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$0.510

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Aztec Data Supply Inc.

USA . 3,549 parts In-Stock

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$1.543

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$1.543

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AZTECH Wire

Italy . 808 parts In-Stock

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$12.434

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Perfect Parts

USA . 30,172 parts In-Stock

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Lixinc

USA . 14,117 parts In-Stock

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SupplyDigital Components

Austria . 7,605 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,347 parts In-Stock

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Argo Parts USA

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Kulean Microsystems

USA . 2,910 parts In-Stock

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Continental Prestige Electronics

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Assy Fe

Spain . 1,000 parts In-Stock

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TANS Electronics

Latvia . 883 parts In-Stock

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Problanco Electronics

Mexico . 587 parts In-Stock

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Aranea Global

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UHIMA Technologies

Türkiye . 69 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

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Overview

Unlock the power of seamless switching with the NTMFS4899NFT1G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET boasts a single configuration with a built-in diode for enhanced performance. Ideal for various applications, this transistor offers unrivaled reliability and efficiency, ensuring smooth operation every time. Trust in Onsemi's commitment to quality and innovation, and elevate your projects with the NTMFS4899NFT1G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external factors, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making this product more efficient in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against reverse voltage, enhancing the overall functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers rapid response times and high efficiency in controlling electrical currents.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, reducing production time and costs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without being damaged, making it suitable for various power applications.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to mount and secure in electronic devices, ensuring a compact and space-efficient design.

Terminal Form: FLAT

The flat terminal form provides a stable and secure connection, reducing the risk of loose connections or voltage fluctuations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, providing improved efficiency and performance in switching operations.

Maximum Pulsed Drain Current (IDM): 188 A

With a high pulsed drain current rating, this FET can handle sudden surges in current without overheating or malfunctioning.

Avalanche Energy Rating (EAS): 84 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy spikes, ensuring reliable operation in rugged environments.

Maximum Drain Current (Abs) (ID): 75 A

The high maximum drain current rating allows the FET to handle large currents efficiently, making it suitable for high-power applications.

No. of Terminals: 5

Having 5 terminals provides flexibility in circuit connections, allowing for multiple configurations and applications.

Maximum Power Dissipation (Abs): 48 W

The high power dissipation rating indicates the FET's ability to handle large power loads without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices with limited space for components.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and reliability, making this FET a reliable choice for various electronic applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring long-term reliability.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this FET a durable and efficient choice for electronic circuits.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows the FET to operate in both extreme cold and hot environments, increasing its versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides a reliable and corrosion-resistant connection, ensuring stable performance over the FET's operational lifespan.

Maximum Drain Current (ID): 10.4 A

With a high maximum drain current rating, this FET can handle substantial currents, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0075 ohm

The low drain-source on resistance minimizes power loss and heat generation, enhancing the efficiency of the FET in conducting current.

Terminal Position: DUAL

Having dual terminal positions allows for versatile connection options, enabling the FET to be easily integrated into different circuit layouts.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and enhances performance in applications where high current handling is required.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering, speeding up the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating allows for reliable and secure soldering, ensuring stable connections during the FET's operational life.

Maximum Feedback Capacitance (Crss): 165 pF

The low feedback capacitance minimizes signal distortion and enhances the FET's ability to accurately switch and control electrical currents.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4899NFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

10.4 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

165 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

188 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4899NFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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