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NTMFS4837NHT3G

Onsemi

NTMFS4837NHT3G by Onsemi

NTMFS4837NHT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 225A IDM, and 0.008 ohm RDS(ON). Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation. Features include BUILT-IN DIODE, METAL-OXIDE SEMICONDUCTOR tech, and 144mJ EAS rating.

Median Price

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1k+

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Vyrian

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Digiode

USA . 1,870 parts In-Stock

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AZTECH Wire

Italy . 118 parts In-Stock

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Component Stockers USA

USA . 450 parts In-Stock

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Perfect Parts

USA . 23,826 parts In-Stock

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TANS Electronics

Latvia . 6,437 parts In-Stock

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Kulean Microsystems

USA . 5,709 parts In-Stock

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Problanco Electronics

Mexico . 3,789 parts In-Stock

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SupplyDigital Components

Austria . 3,051 parts In-Stock

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Corphita

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Corohmni

South Africa . 402 parts In-Stock

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UHIMA Technologies

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Overview

Unlock the power of efficiency and reliability with the NTMFS4837NHT3G by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) is designed to elevate your switching applications to new heights. Its N-CHANNEL configuration, single with built-in diode, ensures seamless operation while its small outline package guarantees convenience. With a maximum drain current of 10.2 A and a low on-resistance of 0.008 ohm, this transistor delivers top-notch performance. Trust in Onsemi's legacy of excellence and experience the difference with the NTMFS4837NHT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the FET, making it resistant to environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher electron mobility compared to P-channel FETs, making them suitable for high-performance switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power handling capabilities, making it ideal for power management in various electronic devices.

Maximum Pulsed Drain Current (IDM): 225 A

With a high maximum pulsed drain current, this FET can handle sudden spikes in current without getting damaged, ensuring reliable performance in demanding conditions.

Avalanche Energy Rating (EAS): 144 mJ

The high avalanche energy rating allows the FET to withstand transient voltage spikes and maintain protection against voltage surges, ensuring the safety of the circuit it is used in.

Maximum Drain Current (ID): 10.2 A

With a high maximum drain current rating, this FET can handle continuous current flow efficiently, making it suitable for applications requiring high power output.

Maximum Drain-Source On Resistance: 0.008 ohm

The low drain-source on resistance results in minimal power loss and heat generation, enhancing the overall efficiency of the FET in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4837NHT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

144 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

10.2 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

225 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4837NHT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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