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NTMFD6H840NLT1G

Onsemi

NTMFD6H840NLT1G by Onsemi

NTMFD6H840NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 80V DS breakdown voltage, and 336A max pulsed drain current. It is used in applications requiring high power dissipation, such as power supplies and motor control systems.

Median Price

$3.180

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 490 parts In-Stock

1+ parts

$3.180

100+ parts

$1.432

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$1.212

10k+ parts

$0.991

490

$3.180

$1.432

$1.212

$0.991

Distributors (In-Stock)

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Vyrian

USA . 1,941 parts In-Stock

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Digiode

USA . 681 parts In-Stock

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681

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Microchip USA

USA . 253 parts In-Stock

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$8.455

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253

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AZTECH Wire

Italy . 178 parts In-Stock

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$19.420

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Component Stockers USA

USA . 5,510 parts In-Stock

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$21.860

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TANS Electronics

Latvia . 6,339 parts In-Stock

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Problanco Electronics

Mexico . 3,562 parts In-Stock

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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Corphita

USA . 1,829 parts In-Stock

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SupplyDigital Components

Austria . 396 parts In-Stock

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Corohmni

South Africa . 368 parts In-Stock

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UHIMA Technologies

Türkiye . 347 parts In-Stock

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Kulean Microsystems

USA . 229 parts In-Stock

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Overview

Unleash the power of innovation with the NTMFD6H840NLT1G by Onsemi. Designed with precision and quality, this N-CHANNEL Power Field Effect Transistor (FET) offers exceptional performance and reliability for a wide range of applications. Whether you're looking to enhance your circuit design or improve efficiency, this transistor provides unmatched value with its high power dissipation, low on-resistance, and dual element configuration. Trust in Onsemi's expertise and elevate your projects to new heights with the NTMFD6H840NLT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and protection for the internal components of the power FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher electron mobility, making them efficient for power applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having 2 separate elements with a built-in diode provides flexibility in circuit design and allows for more efficient power management.

Surface Mount: YES

Surface mount capability enables easy and compact installation of the power FET on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80V, this power FET can handle higher voltage applications without the risk of damage.

Maximum Pulsed Drain Current (IDM): 336 A

High pulsed drain current capability allows the power FET to handle peak power requirements and sudden load surges effectively.

Maximum Drain Current (Abs) (ID): 74 A

The maximum drain current of 74A ensures that the power FET can handle high continuous current flow without overheating or failure.

Maximum Power Dissipation (Abs): 90 W

With a maximum power dissipation of 90W, this FET can efficiently handle power conversion and amplification tasks without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability, low power consumption, and fast switching speeds, making it ideal for power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures reliable performance in a wide range of operating conditions and environments.

Technical Specifications

Power Field Effect Transistors (FET) NTMFD6H840NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

297 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.0088 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JESD-30 Code:

R-PDSO-F8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

336 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NTMFD6H840NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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