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NTMFD4C87NT3G

Onsemi

NTMFD4C87NT3G by Onsemi

NTMFD4C87NT3G by Onsemi is an N-CHANNEL Power FET with 26.6A max drain current and 3.51W max power dissipation. Ideal for applications requiring high power handling in surface mount configurations, such as power supplies and motor control systems operating up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,789 parts In-Stock

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Digiode

USA . 1,103 parts In-Stock

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AZTECH Wire

Italy . 219 parts In-Stock

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$12.280

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QUARKTWIN TECHNOLOGY LTD

USA . 19,865 parts In-Stock

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Problanco Electronics

Mexico . 7,400 parts In-Stock

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SupplyDigital Components

Austria . 6,958 parts In-Stock

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Kulean Microsystems

USA . 3,344 parts In-Stock

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TANS Electronics

Latvia . 1,756 parts In-Stock

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UHIMA Technologies

Türkiye . 381 parts In-Stock

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Corphita

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Corohmni

South Africa . 100 parts In-Stock

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Overview

Upgrade your electronic devices with the NTMFD4C87NT3G by Onsemi, a top-quality N-CHANNEL Power Field Effect Transistor. Manufactured by Onsemi, this high-performance FET offers unmatched reliability and efficiency for a wide range of applications. With a maximum drain current of 26.6 A and a maximum power dissipation of 3.51 W, this transistor is designed to deliver superior performance even in demanding conditions. Trust Onsemi to provide cutting-edge technology that enhances the functionality of your products.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them a popular choice for power electronics applications.

Surface Mount: YES

Surface mount FETs are easy to solder onto printed circuit boards, saving space and improving manufacturability.

Maximum Drain Current (Abs) (ID): 26.6 A

High maximum drain current allows this FET to handle large loads or currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 3.51W

With a high maximum power dissipation, this FET can operate at high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance, low power consumption, and reliability in FETs.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures in demanding environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time minimizes thermal stress on the FET during soldering, improving reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and connection integrity, even in lead-free assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NTMFD4C87NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

26.6 A

Maximum Drain Current (ID):

26.6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFD4C87NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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