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NTHL185N60S5H

Onsemi

NTHL185N60S5H by Onsemi

NTHL185N60S5H by Onsemi is a Power FET with 600V DS Breakdown Voltage, 53A IDM, and 0.185 ohm RDS(on). Ideal for switching applications, it operates in Enhancement Mode with a max power dissipation of 116W. This N-CHANNEL transistor has a rectangular package shape and can handle up to 150°C operating temperature.

Median Price

$5.475

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 376 parts In-Stock

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$7.240

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$2.750

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DigiKey

USA . 9,556 parts In-Stock

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$3.710

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Flip Electronics (Authorized)

USA . 9,556 parts In-Stock

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9,556

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Vyrian

USA . 1,880 parts In-Stock

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$3.710

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Digiode

USA . 207 parts In-Stock

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$4.883

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207

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Flip Electronics

USA . 9,556 parts In-Stock

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Corohmni

South Africa . 486 parts In-Stock

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$3.710

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486

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Corphita

USA . 1,932 parts In-Stock

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$4.626

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Microchip USA

USA . 218 parts In-Stock

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$21.960

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218

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SupplyDigital Components

Austria . 6,017 parts In-Stock

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Problanco Electronics

Mexico . 5,135 parts In-Stock

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Kulean Microsystems

USA . 2,565 parts In-Stock

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TANS Electronics

Latvia . 2,394 parts In-Stock

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UHIMA Technologies

Türkiye . 59 parts In-Stock

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Overview

Discover the power and efficiency of the NTHL185N60S5H by Onsemi, a top-of-the-line Power Field Effect Transistor designed for switching applications. With a minimum DS Breakdown Voltage of 600V and a Maximum Drain Current of 15A, this N-channel transistor offers unparalleled performance and reliability. The single configuration with built-in diode ensures seamless operation, while the Metal-Oxide Semiconductor technology guarantees optimal functionality. Trust in Onsemi's expertise and elevate your projects with the NTHL185N60S5H for enhanced efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good insulation and protection for the transistor, making it durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for various applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600V, this FET can handle high voltage applications effectively.

Maximum Pulsed Drain Current (IDM): 53 A

The high pulsed drain current rating of 53A allows this FET to handle high current spikes and pulses.

Avalanche Energy Rating (EAS): 124 mJ

The high avalanche energy rating means the FET can withstand energy spikes and transients without damage.

Maximum Power Dissipation (Abs): 116 W

With a maximum power dissipation of 116W, this FET can handle high power applications without overheating.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate reliably in high temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) NTHL185N60S5H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

124 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.185 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

53 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHL185N60S5H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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