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NTD4969N-35G

Onsemi

NTD4969N-35G by Onsemi

NTD4969N-35G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 150A IDM, and 0.019 ohm RDS(on). Ideal for SWITCHING applications, it features an N-CHANNEL configuration in PLASTIC/EPOXY package with built-in DIODE. Operating at up to 175 °C, it has a max power dissipation of 26.3W.

Median Price

$0.229

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43,490 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

43,490

-

$0.238

$0.197

$0.176

Verical

USA . 35,765 parts In-Stock

1+ parts

-

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$0.220

35,765

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-

$0.220

Distributors (In-Stock)

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Digiode

USA . 301 parts In-Stock

1+ parts

$0.185

100+ parts

-

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301

$0.185

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Vyrian

USA . 6,222 parts In-Stock

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6,222

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Distributors (Availability)

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Corphita

USA . 479 parts In-Stock

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$0.176

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479

$0.176

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Corohmni

South Africa . 324 parts In-Stock

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$0.195

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324

$0.195

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Component Stockers USA

USA . 37,797 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

37,797

$0.200

$0.190

$0.170

$0.170

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$13.010

100+ parts

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386

$13.010

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Continental Prestige Electronics

USA . 43,490 parts In-Stock

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$0.179

10k+ parts

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43,490

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$0.179

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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TANS Electronics

Latvia . 8,126 parts In-Stock

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Kulean Microsystems

USA . 7,986 parts In-Stock

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7,986

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SupplyDigital Components

Austria . 7,228 parts In-Stock

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7,228

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Problanco Electronics

Mexico . 1,562 parts In-Stock

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1,562

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UHIMA Technologies

Türkiye . 871 parts In-Stock

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871

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Overview

Unlock the power of innovation with the NTD4969N-35G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and performance in their Power Field Effect Transistors (FET). Ideal for switching applications, this N-channel transistor offers a single configuration with a built-in diode, providing customers with enhanced efficiency and reliability. With a maximum drain current of 41A and a low on-resistance of 0.019 ohm, this transistor is designed to meet the demands of high-power applications. Trust Onsemi to bring you cutting-edge technology that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection to the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making this product ideal for applications requiring rapid switching.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides reliable and efficient performance in various electronic circuits.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle high voltage levels without breakdown, ensuring stable operation in demanding conditions.

Maximum Drain Current (ID): 41 A

The high maximum drain current rating allows this FET to handle large current loads, making it suitable for power-hungry applications.

Maximum Power Dissipation (Abs): 26.3 W

With a high power dissipation rating, this FET can handle heat dissipation efficiently, ensuring reliable operation even under high power conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating allows this FET to perform reliably in high-temperature environments without overheating.

Maximum Time At Peak Reflow Temperature (s): 30

This FET can withstand peak reflow temperatures for up to 30 seconds, making it easy to integrate into manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTD4969N-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

15 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

41 A

Maximum Drain Current (ID):

9.4 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4969N-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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