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NTD4963N-35G

Onsemi

NTD4963N-35G by Onsemi

NTD4963N-35G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 132A IDM, and 0.016 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is IN-LINE with SILICON transistor element material.

Median Price

$6.520

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,340 parts In-Stock

1+ parts

$0.160

100+ parts

$0.160

1k+ parts

$0.150

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-

17,340

$0.160

$0.160

$0.150

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Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$12.880

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25

$12.880

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Distributors (In-Stock)

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Digiode

USA . 829 parts In-Stock

1+ parts

$12.236

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829

$12.236

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Vyrian

USA . 4,679 parts In-Stock

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4,679

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Distributors (Availability)

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.005

100+ parts

$0.915

1k+ parts

$0.824

10k+ parts

-

3,000

$1.005

$0.915

$0.824

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AZTECH Wire

Italy . 279 parts In-Stock

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$10.130

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279

$10.130

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Corphita

USA . 2,241 parts In-Stock

1+ parts

$11.592

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2,241

$11.592

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Corohmni

South Africa . 50 parts In-Stock

1+ parts

$12.880

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50

$12.880

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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TANS Electronics

Latvia . 8,378 parts In-Stock

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8,378

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SupplyDigital Components

Austria . 5,653 parts In-Stock

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Problanco Electronics

Mexico . 5,216 parts In-Stock

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Kulean Microsystems

USA . 3,514 parts In-Stock

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3,514

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Perfect Parts

USA . 2,822 parts In-Stock

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2,822

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UHIMA Technologies

Türkiye . 248 parts In-Stock

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248

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Overview

Discover the power of the NTD4963N-35G by Onsemi, a high-quality Power Field Effect Transistor that offers exceptional performance in switching applications. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL FET with a built-in diode provides reliable and efficient operation. Ideal for a variety of applications, this transistor is designed for enhancement mode operation with a maximum drain current of 44 A. With a low on-resistance of 0.016 ohm and a maximum power dissipation of 35.7 W, the NTD4963N-35G delivers value and benefits to customers seeking high-performance components for their electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for various applications in different environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this transistor a good choice for many switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers reliable performance and efficiency when used in circuits that require rapid on/off states.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and typically have lower leakage current, making this transistor a reliable choice for various circuit designs.

Maximum Drain Current (ID): 44 A

With a high maximum drain current rating, this transistor can handle heavy loads and is suitable for applications that require high power handling capabilities.

Maximum Power Dissipation (Abs): 35.7 W

The high power dissipation rating indicates that this transistor can handle high levels of power without overheating, making it reliable in demanding applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can operate reliably in various environments where temperature fluctuations may occur.

Technical Specifications

Power Field Effect Transistors (FET) NTD4963N-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

33.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain Current (ID):

8.1 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

132 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4963N-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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