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NTD4815N-35G

Onsemi

NTD4815N-35G by Onsemi

NTD4815N-35G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 35A ID, and 0.025 ohm RDS(on). Ideal for switching applications, it features an IDM of 87A and EAS of 60.5mJ. Operating in enhancement mode at up to 175 °C, this N-channel transistor has a max power dissipation of 32.6W.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 11 parts In-Stock

1+ parts

$0.780

100+ parts

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11

$0.780

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Rochester

USA . 67,975 parts In-Stock

1+ parts

-

100+ parts

$0.366

1k+ parts

$0.304

10k+ parts

$0.271

67,975

-

$0.366

$0.304

$0.271

Flip Electronics (Authorized)

USA . 49,425 parts In-Stock

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49,425

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Verical

USA . 37,950 parts In-Stock

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$0.380

10k+ parts

$0.339

37,950

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-

$0.380

$0.339

Distributors (In-Stock)

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Digiode

USA . 584 parts In-Stock

1+ parts

$0.286

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584

$0.286

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Flip Electronics

USA . 49,425 parts In-Stock

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49,425

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Vyrian

USA . 8,047 parts In-Stock

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8,047

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Distributors (Availability)

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Corphita

USA . 391 parts In-Stock

1+ parts

$0.271

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391

$0.271

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Corohmni

South Africa . 263 parts In-Stock

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$0.301

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263

$0.301

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Component Stockers USA

USA . 103,617 parts In-Stock

1+ parts

$0.310

100+ parts

$0.290

1k+ parts

$0.260

10k+ parts

$0.260

103,617

$0.310

$0.290

$0.260

$0.260

Microchip USA

USA . 132 parts In-Stock

1+ parts

$5.005

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132

$5.005

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Continental Prestige Electronics

USA . 73,425 parts In-Stock

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$0.282

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73,425

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$0.282

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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TANS Electronics

Latvia . 6,909 parts In-Stock

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Kulean Microsystems

USA . 5,746 parts In-Stock

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SupplyDigital Components

Austria . 4,815 parts In-Stock

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Problanco Electronics

Mexico . 1,853 parts In-Stock

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Perfect Parts

USA . 1,001 parts In-Stock

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UHIMA Technologies

Türkiye . 700 parts In-Stock

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700

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GreenTree Electronics

Israel . 600 parts In-Stock

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600

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Overview

Experience the power of reliability with the NTD4815N-35G by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors, Onsemi ensures top-notch quality and performance in every product. Ideal for switching applications, this N-channel transistor offers enhanced efficiency and durability, making it a valuable asset for various electronic projects. Whether you're a professional or an enthusiast, trust Onsemi to deliver the innovation you need to succeed. Elevate your designs with the NTD4815N-35G and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and heat-resistant housing for the transistor, ensuring reliable performance in various conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance characteristics such as lower on-resistance and higher current carrying capacity compared to P-channel FETs.

Minimum DS Breakdown Voltage: 30 V

Suitable for applications requiring high voltage handling capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for more efficient switching and protection against reverse current flow.

Maximum Pulsed Drain Current (IDM): 87 A

Capable of handling high current pulses, making it suitable for demanding switching applications.

Maximum Power Dissipation (Abs): 32.6 W

Can dissipate significant amounts of power without overheating, ensuring stable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and fast switching speeds, ideal for power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4815N-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

60.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

35 A

Maximum Drain Current (ID):

6.9 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

87 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4815N-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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