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NTD3817N-35G

Onsemi

NTD3817N-35G by Onsemi

NTD3817N-35G by Onsemi is a Power FET with 16V DS Breakdown Voltage, 78A IDM, and 0.029 ohm RDS(on). Ideal for switching applications, it features an N-CHANNEL configuration with a built-in diode. Operating in enhancement mode, this transistor has a max power dissipation of 25.9W and can handle up to 175 °C temperature.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,525 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

15,525

-

$0.225

$0.186

$0.166

Verical

USA . 15,525 parts In-Stock

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-

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$0.208

15,525

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-

$0.208

Distributors (In-Stock)

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Digiode

USA . 125 parts In-Stock

1+ parts

$0.175

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125

$0.175

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Vyrian

USA . 7,488 parts In-Stock

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7,488

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Distributors (Availability)

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Corphita

USA . 265 parts In-Stock

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$0.166

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265

$0.166

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Corohmni

South Africa . 98 parts In-Stock

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$0.184

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98

$0.184

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$0.661

100+ parts

$0.602

1k+ parts

$0.542

10k+ parts

-

2,000

$0.661

$0.602

$0.542

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AZTECH Wire

Italy . 1,024 parts In-Stock

1+ parts

$12.290

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1,024

$12.290

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Continental Prestige Electronics

USA . 15,525 parts In-Stock

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$0.169

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15,525

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$0.169

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SupplyDigital Components

Austria . 8,191 parts In-Stock

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Kulean Microsystems

USA . 4,854 parts In-Stock

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Problanco Electronics

Mexico . 3,996 parts In-Stock

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UHIMA Technologies

Türkiye . 815 parts In-Stock

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815

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TANS Electronics

Latvia . 783 parts In-Stock

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783

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Overview

Elevate your power management solutions with the NTD3817N-35G by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor boasts a single configuration with a built-in diode for seamless switching applications. With a high DS breakdown voltage of 16V and a maximum pulsed drain current of 78A, this transistor ensures reliable performance and efficiency. Whether you're in need of enhanced power control or optimized energy management, the NTD3817N-35G delivers unparalleled value and benefits to meet your specific needs. Choose Onsemi for quality you can trust and performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good insulation and protection for the FET, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making it a good choice for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid transitions between on and off states efficiently.

Minimum DS Breakdown Voltage: 16 V

With a minimum breakdown voltage of 16V, this FET can handle higher voltages, providing robust performance in demanding conditions.

Maximum Pulsed Drain Current (IDM): 78 A

The high pulsed drain current rating of 78A allows this FET to handle sudden surges in current, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 25.9 W

With a maximum power dissipation of 25.9W, this FET can dissipate heat effectively, preventing overheating and ensuring reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low ON-resistance, making this FET a good choice for energy-efficient applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can withstand high temperatures, suitable for a wide range of operating environments.

Maximum Drain-Source On Resistance: 0.029 ohm

The low ON-resistance of 0.029 ohm minimizes power loss and improves efficiency in the FET, making it ideal for high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD3817N-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

15 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

16 V

Maximum Drain Current (Abs) (ID):

34.5 A

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

78 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD3817N-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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