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NTD3055-150-1

Onsemi

NTD3055-150-1 by Onsemi

NTD3055-150-1 by Onsemi is a Power FET with 60V DS Breakdown Voltage, 27A IDM, and 0.15 ohm RDS(on). Ideal for switching applications, it features an N-channel configuration with built-in diode. Operating in enhancement mode, this transistor has a max power dissipation of 1.5W and can handle up to 175 °C temperature.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,400 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

12,400

-

$0.119

$0.099

$0.088

DigiKey

USA . 12,400 parts In-Stock

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-

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$0.100

12,400

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$0.100

Verical

USA . 8,800 parts In-Stock

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$0.110

8,800

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$0.110

Distributors (In-Stock)

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Vyrian

USA . 701 parts In-Stock

1+ parts

$0.079

100+ parts

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701

$0.079

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Digiode

USA . 2,029 parts In-Stock

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$0.093

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2,029

$0.093

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 441 parts In-Stock

1+ parts

$0.079

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441

$0.079

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Corphita

USA . 232 parts In-Stock

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$0.088

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232

$0.088

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-

Component Stockers USA

USA . 10,706 parts In-Stock

1+ parts

$0.100

100+ parts

$0.090

1k+ parts

$0.090

10k+ parts

$0.090

10,706

$0.100

$0.090

$0.090

$0.090

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Continental Prestige Electronics

USA . 12,400 parts In-Stock

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$0.089

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12,400

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$0.089

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QUARKTWIN TECHNOLOGY LTD

USA . 6,635 parts In-Stock

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TANS Electronics

Latvia . 4,641 parts In-Stock

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SupplyDigital Components

Austria . 4,299 parts In-Stock

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Problanco Electronics

Mexico . 3,431 parts In-Stock

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Kulean Microsystems

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 673 parts In-Stock

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673

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Overview

Enhance your electronic devices with the NTD3055-150-1 by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. Manufactured by Onsemi, a reliable and trusted brand in the industry, this N-channel FET offers unparalleled performance and efficiency. With a maximum drain current of 9A and a low on-resistance of 0.15 ohm, this transistor provides exceptional value and benefits to customers looking for high-quality components for their projects. Upgrade your circuits today with the NTD3055-150-1 and experience superior performance like never before.

Feature Benefit Bullets

Minimum DS Breakdown Voltage: 60 V

Higher breakdown voltage allows for safe operation in high voltage applications.

Maximum Pulsed Drain Current (IDM): 27 A

High pulsed drain current capability makes it suitable for applications requiring high power handling.

Maximum Power Dissipation (Abs): 1.5 W

Efficient power dissipation capability ensures stable operation under heavy load conditions.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for use in various environmental conditions.

Maximum Drain-Source On Resistance: 0.15 ohm

Low on-resistance results in minimal power loss and higher efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD3055-150-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

30 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

27 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD3055-150-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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