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NTD3055-150G

Onsemi

NTD3055-150G by Onsemi

NTD3055-150G by Onsemi is a N-channel Power FET with 60V DS breakdown voltage and 27A IDM. Ideal for switching applications, it features a built-in diode, 30mJ EAS rating, and 0.15 ohm RDS(on). Operating in enhancement mode, it has a max power dissipation of 28.8W and temp range of -55 to 175 °C.

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1k+

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Vyrian

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LWI Electronics Inc

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AZTECH Wire

Italy . 988 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

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Kulean Microsystems

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UHIMA Technologies

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TANS Electronics

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Overview

Enhance your power switching applications with the high-quality NTD3055-150G by Onsemi! This N-channel Power FET offers unmatched reliability and performance in a compact package. With a built-in diode and excellent power dissipation capabilities, this transistor is perfect for a wide range of switching tasks. Trust Onsemi's expertise and upgrade your designs with the NTD3055-150G for enhanced efficiency and durability. Elevate your projects to the next level with this advanced semiconductor technology at your fingertips!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the components inside the package, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for power applications due to their high efficiency and low on-state resistance, making this product suitable for high-power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching speeds and protects the FET from reverse voltage, making it ideal for applications where rapid switching is required.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and low on-state resistance, making it a reliable choice for power control systems.

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and space in the design of electronic circuits.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this FET can handle high voltages, making it suitable for use in power electronics applications.

Maximum Pulsed Drain Current (IDM): 27 A

The high pulsed drain current rating indicates the FET's ability to handle short-term peak currents without damage, making it suitable for high-power transient applications.

Maximum Power Dissipation (Abs): 28.8 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable operation in high-power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate in harsh environments without performance degradation, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD3055-150G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

30 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

40 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

28.8 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

27 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

75 ns

Maximum Turn On Time (ton):

105 ns

Trade Compliance

NTD3055-150G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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