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NTD3813NT4G

Onsemi

NTD3813NT4G by Onsemi

NTD3813NT4G by Onsemi is an N-CHANNEL FET with 16V DS Breakdown Voltage and 114A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0145 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE up to 175 °C.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 135,979 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

135,979

-

$0.251

$0.208

$0.186

Verical

USA . 135,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.232

135,979

-

-

-

$0.232

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,221 parts In-Stock

1+ parts

$0.196

100+ parts

-

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2,221

$0.196

-

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Vyrian

USA . 3,404 parts In-Stock

1+ parts

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3,404

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Prism Electronics

USA . 49 parts In-Stock

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49

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Distributors (Availability)

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Corphita

USA . 736 parts In-Stock

1+ parts

$0.185

100+ parts

-

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-

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736

$0.185

-

-

-

Corohmni

South Africa . 166 parts In-Stock

1+ parts

$0.206

100+ parts

-

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10k+ parts

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166

$0.206

-

-

-

Component Stockers USA

USA . 127,617 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

$0.180

127,617

$0.210

$0.200

$0.180

$0.180

AZTECH Wire

Italy . 825 parts In-Stock

1+ parts

$9.690

100+ parts

-

1k+ parts

-

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825

$9.690

-

-

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Continental Prestige Electronics

USA . 135,981 parts In-Stock

1+ parts

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100+ parts

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$0.189

10k+ parts

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135,981

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$0.189

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Perfect Parts

USA . 24,293 parts In-Stock

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24,293

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Kepictronics

USA . 10,065 parts In-Stock

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10,065

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TANS Electronics

Latvia . 7,647 parts In-Stock

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7,647

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Kulean Microsystems

USA . 3,456 parts In-Stock

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3,456

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Problanco Electronics

Mexico . 1,970 parts In-Stock

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1,970

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SupplyDigital Components

Austria . 210 parts In-Stock

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210

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UHIMA Technologies

Türkiye . 35 parts In-Stock

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35

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Overview

Elevate your power management system with the NTD3813NT4G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a maximum drain current of 51A and an enhanced mode configuration, this transistor is designed to optimize power efficiency and reliability. From its small outline package style to its high breakdown voltage of 16V, this product provides exceptional value and benefits to customers seeking top-notch quality and performance. Upgrade your power systems with the NTD3813NT4G and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel type offers better performance and efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides added functionality for the application.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 16 V

With a minimum breakdown voltage of 16V, this transistor can handle higher voltage requirements.

Package Shape: RECTANGULAR

Rectangular shape enables easy placement and secure soldering on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control and enhances the efficiency of the transistor.

Maximum Pulsed Drain Current (IDM): 114 A

High pulsed drain current capability allows for handling sudden load surges without damage.

Avalanche Energy Rating (EAS): 15 mJ

Avalanche energy rating ensures the transistor can withstand high energy spikes without failing.

Maximum Drain Current (Abs) (ID): 51 A

High maximum drain current rating allows for reliable operation under heavy load conditions.

No. of Terminals: 2

Minimal terminal count simplifies circuit layout and reduces complexity in connection.

Maximum Power Dissipation (Abs): 34.9 W

High power dissipation capability ensures the transistor can handle significant power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves PCB space and allows for compact design in electronic applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in transistor operation.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance allows for use in demanding environments without performance degradation.

Transistor Element Material: SILICON

Silicon material for the transistor element provides stable and consistent performance over extended usage.

Terminal Finish: TIN

Tin terminal finish ensures good electrical conductivity and corrosion resistance for long-term reliability.

Maximum Drain Current (ID): 9.6 A

High maximum drain current rating enables the transistor to handle various load conditions without issues.

Maximum Drain-Source On Resistance: 0.0145 ohm

Low drain-source on resistance minimizes power loss and increases efficiency in transistor operation.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in the circuit design.

Case Connection: DRAIN

Drain connection type provides efficient current flow and easy integration in the circuit layout.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering during assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NTD3813NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

15 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

16 V

Maximum Drain Current (Abs) (ID):

51 A

Maximum Drain Current (ID):

9.6 A

Maximum Drain-Source On Resistance:

.0145 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

114 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD3813NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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