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NTD25P03L1

Onsemi

NTD25P03L1 by Onsemi

NTD25P03L1 by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 75A IDM, 200mJ EAS, and 0.08 ohm RDS(ON). With a max power dissipation of 75W and operating temperature up to 150 °C, it's suitable for various ENHANCEMENT MODE switching tasks.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 5 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

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5

$0.770

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$0.500

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Vyrian

USA . 6,692 parts In-Stock

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Digiode

USA . 62 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 414 parts In-Stock

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$0.770

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414

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AZTECH Wire

Italy . 470 parts In-Stock

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$12.050

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470

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TANS Electronics

Latvia . 5,564 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,803 parts In-Stock

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Problanco Electronics

Mexico . 4,460 parts In-Stock

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Corphita

USA . 2,038 parts In-Stock

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UHIMA Technologies

Türkiye . 855 parts In-Stock

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Kulean Microsystems

USA . 296 parts In-Stock

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Overview

Enhance your electronic devices with the NTD25P03L1 by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With a maximum drain current of 25A and an on-resistance of 0.08 ohms, this P-Channel transistor offers superior performance and reliability. Benefit from its single configuration with built-in diode, ensuring seamless integration into your circuits. Trust Onsemi's expertise in semiconductor technology to deliver exceptional products that meet your power management needs. Upgrade your systems with the NTD25P03L1 and experience efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where P-channel transistors are required.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a built-in diode.

Transistor Application: SWITCHING

Designed specifically for switching applications.

Minimum DS Breakdown Voltage: 30 V

Withstands high voltages, making it suitable for various applications.

Avalanche Energy Rating (EAS): 200 mJ

Can handle short duration high-energy pulses.

Maximum Power Dissipation (Abs): 75 W

Capable of dissipating high amounts of power without failure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for efficient performance.

Maximum Operating Temperature: 150 °C

Operates reliably at high temperatures.

Maximum Drain-Source On Resistance: 0.08 ohm

Provides low resistance for efficient conduction.

Technical Specifications

Power Field Effect Transistors (FET) NTD25P03L1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

75 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD25P03L1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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