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NTD20N03L27-1G

Onsemi

NTD20N03L27-1G by Onsemi

NTD20N03L27-1G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 60A IDM, and 0.031 ohm RDS. Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Features include built-in diode, 288mJ EAS rating, and SILICON element material.

Median Price

$0.384

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,445 parts In-Stock

1+ parts

-

100+ parts

$0.370

1k+ parts

$0.307

10k+ parts

$0.274

17,445

-

$0.370

$0.307

$0.274

DigiKey

USA . 17,445 parts In-Stock

1+ parts

-

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$0.460

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17,445

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$0.460

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Verical

USA . 12,572 parts In-Stock

1+ parts

-

100+ parts

-

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$0.384

10k+ parts

$0.342

12,572

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-

$0.384

$0.342

Distributors (In-Stock)

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Digiode

USA . 2,381 parts In-Stock

1+ parts

$0.288

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2,381

$0.288

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Chip Stock

USA . 28,700 parts In-Stock

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28,700

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Vyrian

USA . 8,102 parts In-Stock

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8,102

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Distributors (Availability)

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Corphita

USA . 1,530 parts In-Stock

1+ parts

$0.273

100+ parts

-

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1,530

$0.273

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Corohmni

South Africa . 176 parts In-Stock

1+ parts

$0.303

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176

$0.303

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Component Stockers USA

USA . 20,093 parts In-Stock

1+ parts

$0.310

100+ parts

$0.290

1k+ parts

$0.270

10k+ parts

$0.270

20,093

$0.310

$0.290

$0.270

$0.270

AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$9.470

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328

$9.470

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Continental Prestige Electronics

USA . 17,645 parts In-Stock

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$0.278

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17,645

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$0.278

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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Kulean Microsystems

USA . 6,473 parts In-Stock

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6,473

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SupplyDigital Components

Austria . 3,544 parts In-Stock

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3,544

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TANS Electronics

Latvia . 3,264 parts In-Stock

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3,264

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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310

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Problanco Electronics

Mexico . 109 parts In-Stock

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109

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Overview

Unlock the power of efficient switching with the NTD20N03L27-1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are ideal for various applications. This N-channel transistor offers enhanced performance and reliability, making it perfect for demanding tasks. With a maximum drain current of 20A and a low on-resistance of 0.031 ohms, this transistor provides excellent value and benefits to customers looking for high-performance components. Upgrade your system with the NTD20N03L27-1G and experience superior efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulating properties for the transistor, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and lower on-resistance compared to P-channel FETs, making it suitable for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps prevent reverse current flow, enhancing the reliability and efficiency of the switching operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in controlling the flow of current.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 60 A

Capable of handling high current pulses, making it ideal for applications requiring short-duration high current loads.

Maximum Power Dissipation (Abs): 1.75 W

Can dissipate relatively high power levels, ensuring stable operation even under high load conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate reliably in high-temperature environments without risk of thermal damage.

Technical Specifications

Power Field Effect Transistors (FET) NTD20N03L27-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

288 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD20N03L27-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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