Loading...

NTD14N03R-1

Onsemi

NTD14N03R-1 by Onsemi

NTD14N03R-1 by Onsemi is a single N-channel FET with built-in diode for switching applications. It features a min DS breakdown voltage of 25V, max drain current of 11.4A, and max pulsed drain current of 28A. This MOSFET operates in enhancement mode with a max power dissipation of 20.8W at a max temp of 150 °C, making it suitable for various power control applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,663

-

-

-

-

Vyrian

USA . 1,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

SupplyDigital Components

Austria . 5,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,956

-

-

-

-

Kulean Microsystems

USA . 3,314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,314

-

-

-

-

Problanco Electronics

Mexico . 2,730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,730

-

-

-

-

TANS Electronics

Latvia . 1,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

-

-

-

-

Corphita

USA . 1,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,407

-

-

-

-

Corohmni

South Africa . 292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

292

-

-

-

-

UHIMA Technologies

Türkiye . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

185

-

-

-

-

Overview

Unlock the power of precision with the NTD14N03R-1 by Onsemi. Crafted with top-tier materials and advanced technology, this Power Field Effect Transistor boasts unmatched reliability for a range of switching applications. Its innovative design ensures seamless performance, while its high-quality construction guarantees long-lasting durability. Experience enhanced efficiency and superior functionality with the NTD14N03R-1, setting a new standard in the world of FETs. Elevate your projects with this exceptional component from a trusted manufacturer, delivering unparalleled value and performance to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the FET, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer lower ON-resistance and higher efficiency compared to P-CHANNEL FETs, making them ideal for high power switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET efficiently controls the flow of current in electronic circuits, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 28 A

With a high maximum pulsed drain current rating of 28 A, this FET can handle brief surges of current, making it suitable for applications with high peak power demands.

Maximum Power Dissipation (Abs): 20.8 W

The high maximum power dissipation rating of 20.8 W indicates that this FET can handle significant power levels without overheating, ensuring reliable operation under various conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand higher temperatures than standard components, making it suitable for applications where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) NTD14N03R-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

11.4 A

Maximum Drain Current (ID):

11.4 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD14N03R-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19