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NTD110N02R-001

Onsemi

NTD110N02R-001 by Onsemi

NTD110N02R-001 by Onsemi is a Power FET with 24V DS Breakdown Voltage, 110A IDM, and 0.0062 ohm RDS(on). Ideal for SWITCHING applications, it features an ENHANCEMENT MODE operation and 120mJ EAS rating. With a max power dissipation of 110W and operating temperature up to 175 °C, this N-CHANNEL transistor in PLASTIC/EPOXY package is suitable for high-power electronic designs.

Median Price

$0.291

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,672 parts In-Stock

1+ parts

-

100+ parts

$0.291

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$0.241

10k+ parts

$0.215

4,672

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$0.291

$0.241

$0.215

DigiKey

USA . 4,672 parts In-Stock

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-

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$0.360

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4,672

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$0.360

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Verical

USA . 3,687 parts In-Stock

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$0.269

3,687

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$0.269

Distributors (In-Stock)

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Digiode

USA . 813 parts In-Stock

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$0.226

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813

$0.226

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Chip Stock

USA . 59,000 parts In-Stock

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59,000

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Vyrian

USA . 11,456 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 810 parts In-Stock

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$0.214

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810

$0.214

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Corohmni

South Africa . 328 parts In-Stock

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$0.238

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328

$0.238

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AZTECH Wire

Italy . 283 parts In-Stock

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$20.460

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283

$20.460

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Kepictronics

USA . 19,195 parts In-Stock

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Kulean Microsystems

USA . 8,122 parts In-Stock

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Problanco Electronics

Mexico . 6,900 parts In-Stock

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6,900

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A-Z Elektronik GmbH

Germany . 5,366 parts In-Stock

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Continental Prestige Electronics

USA . 4,672 parts In-Stock

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$0.219

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4,672

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$0.219

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SupplyDigital Components

Austria . 1,280 parts In-Stock

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UHIMA Technologies

Türkiye . 926 parts In-Stock

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TANS Electronics

Latvia . 910 parts In-Stock

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Overview

Unlock the power of your devices with the NTD110N02R-001 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled quality and reliability. Perfect for switching applications, this N-CHANNEL transistor provides enhanced performance and efficiency. With a maximum pulsing drain current of 110A and a minimum DS breakdown voltage of 24V, this transistor delivers exceptional power while maintaining a compact form factor. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the NTD110N02R-001 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and helps protect the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current carrying capacity compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved efficiency and protection against reverse current flow, enhancing the overall reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current and voltage in various electronic circuits.

Minimum DS Breakdown Voltage: 24 V

With a minimum breakdown voltage of 24V, this FET can handle higher voltage levels, making it suitable for applications requiring robust performance.

Maximum Pulsed Drain Current (IDM): 110 A

The high pulsed drain current rating of 110A allows this FET to handle surges in current effectively, making it ideal for applications with varying load conditions.

Maximum Power Dissipation (Abs): 110 W

With a maximum power dissipation of 110W, this FET can efficiently dissipate heat generated during operation, ensuring reliable performance under high power conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows this FET to operate in harsh environments without overheating, ensuring long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTD110N02R-001 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

12.5 A

Maximum Drain-Source On Resistance:

.0062 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

110 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD110N02R-001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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