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NLX1G10BMX1TCG

Onsemi

NLX1G10BMX1TCG by Onsemi

NLX1G10BMX1TCG by Onsemi is a CMOS Logic Gate with 3 inputs, 19ns propagation delay, and operates b/w -55 to 125 °C. It is a surface-mount device in a small outline package suitable for military-grade applications requiring fast signal processing within the voltage range of 1.65V to 5.5V.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

66,000

-

$0.119

$0.099

$0.088

DigiKey

USA . 66,000 parts In-Stock

1+ parts

-

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$0.100

66,000

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-

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$0.100

Verical

USA . 66,000 parts In-Stock

1+ parts

-

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$0.110

66,000

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-

-

$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 96 parts In-Stock

1+ parts

$0.093

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-

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96

$0.093

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Vyrian

USA . 1,599 parts In-Stock

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$0.098

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1,599

$0.098

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Distributors (Availability)

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Corphita

USA . 1,148 parts In-Stock

1+ parts

$0.088

100+ parts

-

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1,148

$0.088

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Vigor

Singapore . 517 parts In-Stock

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$0.090

100+ parts

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517

$0.090

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Corohmni

South Africa . 480 parts In-Stock

1+ parts

$0.098

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480

$0.098

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Component Stockers USA

USA . 74,418 parts In-Stock

1+ parts

$0.100

100+ parts

$0.090

1k+ parts

$0.080

10k+ parts

$0.080

74,418

$0.100

$0.090

$0.080

$0.080

Continental Prestige Electronics

USA . 66,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.085

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66,000

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$0.085

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TANS Electronics

Latvia . 6,407 parts In-Stock

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6,407

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SupplyDigital Components

Austria . 5,219 parts In-Stock

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5,219

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Microchip USA

USA . 4,492 parts In-Stock

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4,492

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Problanco Electronics

Mexico . 3,945 parts In-Stock

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Kulean Microsystems

USA . 186 parts In-Stock

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UHIMA Technologies

Türkiye . 77 parts In-Stock

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77

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Overview

Enhance your electronic projects with the NLX1G10BMX1TCG by Onsemi, a high-quality logic gate that delivers reliable performance and efficiency. Manufactured by Onsemi, a trusted industry leader, this product offers superior functionality and precision. Ideal for a wide range of applications, this logic gate is perfect for creating innovative solutions in various electronic devices. Experience the value and benefits of this exceptional product, designed to meet your needs and exceed your expectations. Upgrade your projects today with the NLX1G10BMX1TCG and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the logic gates, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability makes it easier to integrate these logic gates into circuit boards, saving space and simplifying the assembly process.

No. of Inputs: 3

Having 3 inputs allows for more complex logic operations to be performed, increasing the versatility of the logic gates.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage of 1.8V makes these logic gates suitable for low-power applications, reducing energy consumption.

Propagation Delay (tpd): 19 ns

Fast propagation delay of 19ns ensures quick response times, important for time-sensitive applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making the logic gates versatile and efficient.

Technical Specifications

Logic Gates NLX1G10BMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G10BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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