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NLX1G11AMUTCG

Onsemi

NLX1G11AMUTCG by Onsemi

NLX1G11AMUTCG by Onsemi is a CMOS Logic Gate with 3 inputs, 19ns propagation delay at 5V. It operates in temperatures from -55 to 125 °C and has a load capacitance of 15pF. Ideal for military applications due to its small outline package style and dual terminal position.

Median Price

$0.109

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70,971 parts In-Stock

1+ parts

-

100+ parts

$0.109

1k+ parts

$0.090

10k+ parts

$0.080

70,971

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$0.109

$0.090

$0.080

DigiKey

USA . 70,971 parts In-Stock

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$0.140

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$0.140

Verical

USA . 37,573 parts In-Stock

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$0.101

37,573

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$0.101

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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Digiode

USA . 1,182 parts In-Stock

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$0.083

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$0.083

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Chip Stock

USA . 34,000 parts In-Stock

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Vyrian

USA . 6,468 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 171 parts In-Stock

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$0.068

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171

$0.068

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Corphita

USA . 1,965 parts In-Stock

1+ parts

$0.078

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$0.078

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Vigor

Singapore . 747 parts In-Stock

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$0.080

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Component Stockers USA

USA . 49,819 parts In-Stock

1+ parts

$0.090

100+ parts

$0.080

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$0.080

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$0.080

49,819

$0.090

$0.080

$0.080

$0.080

Ampacity Inc.

Singapore . 45,266 parts In-Stock

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$0.126

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AZTECH Wire

Italy . 821 parts In-Stock

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$16.020

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$16.020

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Continental Prestige Electronics

USA . 70,971 parts In-Stock

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$0.066

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Kulean Microsystems

USA . 7,626 parts In-Stock

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Assy Fe

Spain . 2,981 parts In-Stock

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SupplyDigital Components

Austria . 2,547 parts In-Stock

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Problanco Electronics

Mexico . 2,213 parts In-Stock

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TANS Electronics

Latvia . 1,519 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 982 parts In-Stock

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Microchip USA

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Overview

Experience unparalleled performance with the NLX1G11AMUTCG by Onsemi, a leading manufacturer in logic gates. This cutting-edge product offers fast propagation delay and low power consumption, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile component provides reliable functionality and precise results. Upgrade your designs with the NLX1G11AMUTCG and discover the quality and value that Onsemi delivers to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 19 ns

With a low propagation delay, this product ensures fast signal processing which is essential in many electronic applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard power supplies used in many electronic systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for digital logic operations.

Technical Specifications

Logic Gates NLX1G11AMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

19 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G11AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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