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NLVVHC1G86DFT2G

Onsemi

NLVVHC1G86DFT2G by Onsemi

NLVVHC1G86DFT2G by Onsemi is a CMOS Logic Gate with 2 inputs, 12ns propagation delay at 5V. It operates in temperatures from -55 to 125 °C and has a load capacitance of 50pF. Ideal for military applications due to AEC-Q100 screening level and small outline package style.

Median Price

$0.135

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2,980 parts In-Stock

1+ parts

$0.131

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$0.123

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$0.112

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$0.131

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Avnet

USA . 2,980 parts In-Stock

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$0.140

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$0.130

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$0.130

Farnell

UK . 2,980 parts In-Stock

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$0.135

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Digiode

USA . 530 parts In-Stock

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$0.124

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530

$0.124

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Vyrian

USA . 8,749 parts In-Stock

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Corphita

USA . 1,650 parts In-Stock

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$0.118

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$0.118

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Vigor

Singapore . 522 parts In-Stock

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$0.130

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522

$0.130

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Corohmni

South Africa . 459 parts In-Stock

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$0.131

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459

$0.131

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AZTECH Wire

Italy . 253 parts In-Stock

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$11.670

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253

$11.670

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,752 parts In-Stock

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TANS Electronics

Latvia . 8,037 parts In-Stock

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SupplyDigital Components

Austria . 7,127 parts In-Stock

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Kulean Microsystems

USA . 4,632 parts In-Stock

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Continental Prestige Electronics

USA . 2,980 parts In-Stock

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Microchip USA

USA . 2,448 parts In-Stock

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Problanco Electronics

Mexico . 1,192 parts In-Stock

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UHIMA Technologies

Türkiye . 452 parts In-Stock

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452

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Overview

Experience the unmatched quality and reliability of Onsemi with the NLVVHC1G86DFT2G Logic Gate. This versatile component is perfect for a wide range of applications, from automotive to industrial electronics. With a fast propagation delay and low power consumption, this logic gate offers exceptional performance while maintaining high durability in extreme temperatures. Trust Onsemi for innovative solutions that bring value and efficiency to your projects. Elevate your designs with the NLVVHC1G86DFT2G Logic Gate today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast signal processing and execution.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

No. of Inputs: 2

Provides flexibility for different input configurations in logic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with many electronic systems.

Maximum Operating Temperature: 125 °C

Withstands high operating temperatures, suitable for various environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLVVHC1G86DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19.5 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1G86DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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