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NLVVHC1G14DTT1G

Onsemi

NLVVHC1G14DTT1G by Onsemi

NLVVHC1G14DTT1G by Onsemi is a CMOS Logic Gate with Schmitt Trigger. It operates at 3V, has 5 terminals, and a load capacitance of 50pF. With AEC-Q100 screening level, it's ideal for automotive applications requiring fast propagation delay of 20.5ns in a small outline package.

Median Price

$0.178

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 121,456 parts In-Stock

1+ parts

-

100+ parts

$0.185

1k+ parts

$0.153

10k+ parts

$0.137

121,456

-

$0.185

$0.153

$0.137

Verical

USA . 72,000 parts In-Stock

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$0.171

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$0.171

Distributors (In-Stock)

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Digiode

USA . 1,093 parts In-Stock

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$0.144

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1,093

$0.144

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Vyrian

USA . 6,472 parts In-Stock

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6,472

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Distributors (Availability)

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Corphita

USA . 442 parts In-Stock

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$0.137

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442

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Vigor

Singapore . 385 parts In-Stock

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$0.150

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385

$0.150

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Corohmni

South Africa . 256 parts In-Stock

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$0.152

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256

$0.152

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AZTECH Wire

Italy . 647 parts In-Stock

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$17.500

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647

$17.500

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Authorized Procurement Solutions

USA . 40,000 parts In-Stock

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SupplyDigital Components

Austria . 6,577 parts In-Stock

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TANS Electronics

Latvia . 5,635 parts In-Stock

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Kulean Microsystems

USA . 2,531 parts In-Stock

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Microchip USA

USA . 2,338 parts In-Stock

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Problanco Electronics

Mexico . 2,061 parts In-Stock

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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Overview

Discover the NLVVHC1G14DTT1G by Onsemi, a high-quality Logic Gate suitable for a wide range of applications. Manufactured with precision and reliability in mind, this product offers customers superior performance and value. With its innovative technology and military-grade temperature grade, this Logic Gate ensures optimal functionality even in challenging conditions. Trust Onsemi to deliver products that exceed expectations and unlock endless possibilities for your projects. Experience the difference with the NLVVHC1G14DTT1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gate.

Surface Mount: YES

Enables easy and convenient mounting on a circuit board for efficient assembly.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, suitable for automotive applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for industrial use.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLVVHC1G14DTT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

20.5 ns

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NLVVHC1G14DTT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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