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NLVVHC1G14DFT2G

Onsemi

NLVVHC1G14DFT2G by Onsemi

NLVVHC1G14DFT2G by Onsemi is a CMOS Logic Gate with Schmitt Trigger. It operates at 3V, has 5 terminals, and a load capacitance of 50pF. Suitable for military applications due to its AEC-Q100 screening level and wide temperature range (-55 to 125 °C).

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 8,388 parts In-Stock

1+ parts

$0.320

100+ parts

$0.123

1k+ parts

$0.063

10k+ parts

$0.049

8,388

$0.320

$0.123

$0.063

$0.049

Flip Electronics (Authorized)

USA . 66,000 parts In-Stock

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Digiode

USA . 520 parts In-Stock

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$0.304

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520

$0.304

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Vyrian

USA . 1,445 parts In-Stock

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$0.320

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Flip Electronics

USA . 219,000 parts In-Stock

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Chip Stock

USA . 46,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,203 parts In-Stock

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$0.288

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Component Stockers USA

USA . 7,825 parts In-Stock

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$0.310

100+ parts

$0.120

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$0.060

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7,825

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$0.120

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Corohmni

South Africa . 461 parts In-Stock

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$0.320

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461

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Vigor

Singapore . 801 parts In-Stock

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$0.410

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,942 parts In-Stock

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Problanco Electronics

Mexico . 7,558 parts In-Stock

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SupplyDigital Components

Austria . 6,128 parts In-Stock

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TANS Electronics

Latvia . 4,382 parts In-Stock

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Kepictronics

USA . 3,465 parts In-Stock

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UHIMA Technologies

Türkiye . 892 parts In-Stock

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Microchip USA

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Overview

Experience cutting-edge technology with the NLVVHC1G14DFT2G by Onsemi, a high-quality logic gate that sets the standard for performance and reliability. Manufactured by industry leader Onsemi, this product offers unmatched precision and efficiency in a wide range of applications. From automotive to industrial electronics, this logic gate delivers exceptional value, benefits, and advantages to customers seeking top-tier components for their projects. Trust Onsemi to provide you with the best in class solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage for reliable and stable operation.

Load Capacitance (CL): 50 pF

Suitable for a wide range of applications with different load requirements.

Maximum I (ol): 8 Amp

Can handle high output currents, making it versatile for various uses.

Propagation Delay (tpd): 20.5 ns

Provides fast signal processing and response times.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ideal for industrial and automotive environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions without compromising performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher supply voltages for increased flexibility in circuit design.

Technical Specifications

Logic Gates NLVVHC1G14DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

20.5 ns

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1G14DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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