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NLV74HCT541ADWG

Onsemi

NLV74HCT541ADWG by Onsemi

NLV74HCT541ADWG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 32ns and can withstand temperatures from -55 °C to 125°C. Ideal for military-grade applications requiring small outline packages and dual terminal positions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,820 parts In-Stock

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Digiode

USA . 1,020 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 281 parts In-Stock

1+ parts

$0.540

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281

$0.540

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Ampacity Inc.

Singapore . 1,131 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 758 parts In-Stock

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$11.400

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758

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Component Stockers USA

USA . 324 parts In-Stock

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$99.990

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324

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,123 parts In-Stock

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SupplyDigital Components

Austria . 6,371 parts In-Stock

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Kulean Microsystems

USA . 3,756 parts In-Stock

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Problanco Electronics

Mexico . 3,503 parts In-Stock

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TANS Electronics

Latvia . 3,499 parts In-Stock

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Corphita

USA . 2,179 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Microchip USA

USA . 476 parts In-Stock

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Corohmni

South Africa . 370 parts In-Stock

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UHIMA Technologies

Türkiye . 347 parts In-Stock

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Overview

Enhance your electronic designs with the NLV74HCT541ADWG by Onsemi, a high-quality Bus Driver & Transceiver that offers unmatched performance and reliability. Onsemi is a trusted manufacturer known for producing top-notch components, ensuring that this product meets the highest industry standards. With its 3-STATE output characteristics and TRUE output polarity, this component is perfect for a wide range of applications. Experience the value and benefits of this versatile device, designed to optimize efficiency and functionality in your projects. Upgrade your circuits today with the NLV74HCT541ADWG and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to damage, making this product a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with most systems, making this transceiver versatile for different applications.

No. of Bits: 8

The 8-bit configuration provides sufficient data processing capability for most bus driver and transceiver tasks.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, ensuring reliable performance in various environments.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum supply voltage requirement allows for flexibility in power sources and ensures efficient operation even at lower voltages.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of this bus driver and transceiver.

Technical Specifications

Bus Driver & Transceivers NLV74HCT541ADWG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

32 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV74HCT541ADWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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