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NLV74HCT14ADTR2G

Onsemi

NLV74HCT14ADTR2G by Onsemi

NLV74HCT14ADTR2G by Onsemi is a 6-function logic gate with 48ns propagation delay. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5-5.5V. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.182

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44,023 parts In-Stock

1+ parts

-

100+ parts

$0.189

1k+ parts

$0.157

10k+ parts

$0.140

44,023

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$0.189

$0.157

$0.140

Verical

USA . 37,350 parts In-Stock

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$0.175

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$0.175

Distributors (In-Stock)

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Vyrian

USA . 3,472 parts In-Stock

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Digiode

USA . 1,415 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 36,284 parts In-Stock

1+ parts

$0.160

100+ parts

$0.150

1k+ parts

$0.130

10k+ parts

$0.130

36,284

$0.160

$0.150

$0.130

$0.130

Vigor

Singapore . 291 parts In-Stock

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$0.210

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291

$0.210

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Microchip USA

USA . 5,411 parts In-Stock

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$1.269

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5,411

$1.269

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AZTECH Wire

Italy . 1,197 parts In-Stock

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$17.850

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$17.850

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Ampacity Inc.

Singapore . 41,541 parts In-Stock

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$61.000

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41,541

$61.000

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TANS Electronics

Latvia . 2,434 parts In-Stock

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SupplyDigital Components

Austria . 2,214 parts In-Stock

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Corphita

USA . 1,571 parts In-Stock

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UHIMA Technologies

Türkiye . 945 parts In-Stock

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Kulean Microsystems

USA . 477 parts In-Stock

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Corohmni

South Africa . 217 parts In-Stock

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Problanco Electronics

Mexico . 108 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NLV74HCT14ADTR2G logic gates. These small outline, thin profile components offer a fast propagation delay of 48 ns and a wide operating temperature range from -55 to 125 °C. Perfect for military-grade applications, these logic gates provide exceptional performance and precision for your projects. Trust in the expertise of Onsemi to deliver top-of-the-line technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the logic gates, making it suitable for various environments.

Surface Mount: YES

Surface mount feature allows for easy installation on circuit boards, saving time and effort in the assembly process.

No. of Functions: 6

Having multiple functions in one package saves space on the circuit board and simplifies the design of electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems and power sources.

Propagation Delay (tpd): 48 ns

Low propagation delay ensures fast response times in signal processing, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, the logic gates can withstand harsh environmental conditions and heavy usage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates efficient and reliable in operation.

Technical Specifications

Logic Gates NLV74HCT14ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

48 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HCT14ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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