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NLV74HCT132ADR2G

Onsemi

NLV74HCT132ADR2G by Onsemi

NLV74HCT132ADR2G by Onsemi is a 4-function logic gate with 2 inputs, operating at supply voltages b/w 2-6V. It features a propagation delay of 38ns and output characteristics in 3-state. Ideal for military-grade applications requiring fast response times and low power consumption.

Median Price

$0.168

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36,737 parts In-Stock

1+ parts

-

100+ parts

$0.174

1k+ parts

$0.144

10k+ parts

$0.129

36,737

-

$0.174

$0.144

$0.129

Verical

USA . 36,737 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.161

36,737

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-

-

$0.161

Distributors (In-Stock)

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Digiode

USA . 219 parts In-Stock

1+ parts

$0.136

100+ parts

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219

$0.136

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Vyrian

USA . 4,583 parts In-Stock

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4,583

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Distributors (Availability)

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Corphita

USA . 1,135 parts In-Stock

1+ parts

$0.129

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1,135

$0.129

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Corohmni

South Africa . 389 parts In-Stock

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$0.143

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389

$0.143

-

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Component Stockers USA

USA . 50,327 parts In-Stock

1+ parts

$0.150

100+ parts

$0.140

1k+ parts

$0.120

10k+ parts

$0.120

50,327

$0.150

$0.140

$0.120

$0.120

Vigor

Singapore . 656 parts In-Stock

1+ parts

$0.310

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656

$0.310

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Microchip USA

USA . 4,538 parts In-Stock

1+ parts

$1.098

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4,538

$1.098

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AZTECH Wire

Italy . 471 parts In-Stock

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$22.130

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471

$22.130

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$27.131

100+ parts

$24.689

1k+ parts

$22.247

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-

1,000

$27.131

$24.689

$22.247

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Continental Prestige Electronics

USA . 39,237 parts In-Stock

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$0.171

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39,237

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$0.171

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Problanco Electronics

Mexico . 7,337 parts In-Stock

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Kulean Microsystems

USA . 6,835 parts In-Stock

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SupplyDigital Components

Austria . 3,448 parts In-Stock

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TANS Electronics

Latvia . 3,178 parts In-Stock

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UHIMA Technologies

Türkiye . 27 parts In-Stock

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Overview

Experience the seamless performance and reliability of the NLV74HCT132ADR2G by Onsemi, a top-tier manufacturer known for cutting-edge technology and superior quality. This logic gate is a game-changer in various applications, offering customers unparalleled value with its fast propagation delay and 3-STATE output characteristics. Whether you're working on military-grade projects or seeking high-performance solutions, this product's small outline package and wide operating temperature range make it a versatile choice. Trust Onsemi to deliver innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having 4 functions in one component increases functionality and flexibility in circuit design, reducing the need for multiple separate components.

Propagation Delay (tpd): 38 ns

Low propagation delay of 38 ns ensures fast signal processing, making this product suitable for high-speed applications where timing is critical.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability and performance in harsh environments, making this product suitable for rugged applications.

Technical Specifications

Logic Gates NLV74HCT132ADR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

38 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74HCT132ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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