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NLV74HC589ADG

Onsemi

NLV74HC589ADG by Onsemi

NLV74HC589ADG by Onsemi is an 8-bit digital shift register with a supply voltage of 5V, operating temperature range from -55 to 125 °C, and max frequency of 4MHz. It features a positive edge trigger, true output polarity, and 3-state output characteristics. Ideal for military-grade applications requiring high-speed data storage and retrieval in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,628 parts In-Stock

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Digiode

USA . 1,114 parts In-Stock

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Vigor

Singapore . 252 parts In-Stock

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$0.260

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252

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Andel Nordic

Denmark . 1,436 parts In-Stock

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$0.790

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$0.551

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$0.551

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$0.551

Component Stockers USA

USA . 34,471 parts In-Stock

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$2.770

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AZTECH Wire

Italy . 1,046 parts In-Stock

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$20.620

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Kulean Microsystems

USA . 8,308 parts In-Stock

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TANS Electronics

Latvia . 6,844 parts In-Stock

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SupplyDigital Components

Austria . 3,777 parts In-Stock

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Corphita

USA . 2,062 parts In-Stock

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Problanco Electronics

Mexico . 764 parts In-Stock

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Corohmni

South Africa . 272 parts In-Stock

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Microchip USA

USA . 265 parts In-Stock

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UHIMA Technologies

Türkiye . 61 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the NLV74HC589ADG digital shift register. This versatile component offers customers a wide range of applications in industries such as automotive, telecommunications, and consumer electronics. With its advanced features and durable construction, this product provides exceptional value and performance. Trust Onsemi to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for portable and rugged applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Screening Level: AEC-Q100

High-quality automotive-grade component, ensuring reliability and performance under harsh conditions.

No. of Bits: 8

Sufficient number of bits for various applications requiring digital shift registers.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial settings.

Output Characteristics: 3-STATE

Ability to drive bus lines, reducing power consumption and improving efficiency.

Trigger Type: POSITIVE EDGE

Efficient data transfer triggered on the rising edge of a clock signal.

Technology: CMOS

Low power consumption and compatibility with a wide range of digital circuits.

Maximum Frequency At Nominal Supply: 4000000 Hz

High-speed operation for demanding applications.

Technical Specifications

Digital Shift Registers NLV74HC589ADG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV74HC589ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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