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NLV74HC595ADR2G

Onsemi

NLV74HC595ADR2G by Onsemi

NLV74HC595ADR2G by Onsemi is an 8-bit digital shift register with a supply voltage of 5V. Featuring positive edge trigger and 3-STATE output, it operates b/w -55 to 125°C. Ideal for military-grade applications requiring high-frequency data shifting in compact spaces.

Median Price

$0.206

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2,446 parts In-Stock

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-

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$0.202

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$0.168

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$0.150

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$0.202

$0.168

$0.150

Verical

USA . 1,843 parts In-Stock

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$0.210

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$0.210

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Vyrian

USA . 6,685 parts In-Stock

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Digiode

USA . 2,439 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,234 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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Bristol Electronics

USA . 430 parts In-Stock

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$0.366

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$0.211

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Microfarads

USA . 298 parts In-Stock

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Contempo Components LLC

USA . 49 parts In-Stock

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Vigor

Singapore . 348 parts In-Stock

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$0.320

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$0.320

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Microchip USA

USA . 3,564 parts In-Stock

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$1.276

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AZTECH Wire

Italy . 608 parts In-Stock

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$18.590

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Aztec Data Supply Inc.

USA . 175 parts In-Stock

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$26.470

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Ampacity Inc.

Singapore . 1,956 parts In-Stock

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$47.000

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TANS Electronics

Latvia . 8,309 parts In-Stock

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Kulean Microsystems

USA . 4,885 parts In-Stock

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Continental Prestige Electronics

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Problanco Electronics

Mexico . 2,612 parts In-Stock

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Kepictronics

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Corphita

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SupplyDigital Components

Austria . 1,729 parts In-Stock

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Argo Parts USA

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Aranea Global

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UHIMA Technologies

Türkiye . 660 parts In-Stock

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Corohmni

South Africa . 444 parts In-Stock

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Overview

Enhance your digital electronics projects with the NLV74HC595ADR2G by Onsemi. As a trusted manufacturer of high-quality components, Onsemi delivers top-notch performance and reliability. The NLV74HC595ADR2G is a versatile digital shift register that offers seamless integration, precision output characteristics, and true output polarity. Ideal for a wide range of applications, this product ensures optimal functionality and efficiency. Upgrade your designs with the NLV74HC595ADR2G and experience the exceptional value and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to external elements, making it suitable for various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and making assembly more efficient.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality standards for automotive applications where stringent requirements need to be met.

No. of Bits: 8

With 8 bits, this shift register can handle a wide range of data processing tasks efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard electronic systems and power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh operating conditions without compromising performance.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for multiple devices to be connected to the same output line while preventing conflicts and signal interference.

Trigger Type: POSITIVE EDGE

Positive edge triggering enables precise data capture and synchronization, essential for applications requiring accurate timing control.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Digital Shift Registers NLV74HC595ADR2G attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV74HC595ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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